SNOSCZ8 April   2016 LDC1612-Q1 , LDC1614-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics - I2C
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clocking Architecture
      2. 8.3.2 Multi-Channel and Single Channel Operation
      3. 8.3.3 Current Drive Control Registers
      4. 8.3.4 Device Status Registers
      5. 8.3.5 Input Deglitch Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Startup Mode
      2. 8.4.2 Normal (Conversion) Mode
      3. 8.4.3 Sleep Mode
      4. 8.4.4 Shutdown Mode
        1. 8.4.4.1 Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Specifications
    6. 8.6 Register Maps
      1. 8.6.1  Register List
      2. 8.6.2  Address 0x00, DATA_MSB_CH0
      3. 8.6.3  Address 0x01, DATA_LSB_CH0
      4. 8.6.4  Address 0x02, DATA_MSB_CH1
      5. 8.6.5  Address 0x03, DATA_LSB_CH1
      6. 8.6.6  Address 0x04, DATA_MSB_CH2 (LDC1614 only)
      7. 8.6.7  Address 0x05, DATA_LSB_CH2 (LDC1614 only)
      8. 8.6.8  Address 0x06, DATA_MSB_CH3 (LDC1614 only)
      9. 8.6.9  Address 0x07, DATA_LSB_CH3 (LDC1614 only)
      10. 8.6.10 Address 0x08, RCOUNT_CH0
      11. 8.6.11 Address 0x09, RCOUNT_CH1
      12. 8.6.12 Address 0x0A, RCOUNT_CH2 (LDC1614 only)
      13. 8.6.13 Address 0x0B, RCOUNT_CH3 (LDC1614 only)
      14. 8.6.14 Address 0x0C, OFFSET_CH0
      15. 8.6.15 Address 0x0D, OFFSET_CH1
      16. 8.6.16 Address 0x0E, OFFSET_CH2 (LDC1614 only)
      17. 8.6.17 Address 0x0F, OFFSET_CH3 (LDC1614 only)
      18. 8.6.18 Address 0x10, SETTLECOUNT_CH0
      19. 8.6.19 Address 0x11, SETTLECOUNT_CH1
      20. 8.6.20 Address 0x12, SETTLECOUNT_CH2 (LDC1614 only)
      21. 8.6.21 Address 0x13, SETTLECOUNT_CH3 (LDC1614 only)
      22. 8.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
      23. 8.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
      24. 8.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (LDC1614 only)
      25. 8.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (LDC1614 only)
      26. 8.6.26 Address 0x18, STATUS
      27. 8.6.27 Address 0x19, ERROR_CONFIG
      28. 8.6.28 Address 0x1A, CONFIG
      29. 8.6.29 Address 0x1B, MUX_CONFIG
      30. 8.6.30 Address 0x1C, RESET_DEV
      31. 8.6.31 Address 0x1E, DRIVE_CURRENT_CH0
      32. 8.6.32 Address 0x1F, DRIVE_CURRENT_CH1
      33. 8.6.33 Address 0x20, DRIVE_CURRENT_CH2 (LDC1614 only)
      34. 8.6.34 Address 0x21, DRIVE_CURRENT_CH3 (LDC1614 only)
      35. 8.6.35 Address 0x7E, MANUFACTURER_ID
      36. 8.6.36 Address 0x7F, DEVICE_ID
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Theory of Operation
        1. 9.1.1.1 Conductive Objects in an EM Field
        2. 9.1.1.2 L-C Resonators
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Recommended Initial Register Configuration Values
        2. 9.2.2.2 Inductor Self-Resonant Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Related Links
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

For related links, see the following:

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation, refer to the following:

  • LDC1000 Temperature Compensation (SNAA212)

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Related Links

The Table 49 below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 49. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LDC1612-Q1 Click here Click here Click here Click here Click here
LDC1614-Q1 Click here Click here Click here Click here Click here

12.5 Trademarks

E2E is a trademark of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.