SNOSCZ8 April   2016 LDC1612-Q1 , LDC1614-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description Continued
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics - I2C
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clocking Architecture
      2. 8.3.2 Multi-Channel and Single Channel Operation
      3. 8.3.3 Current Drive Control Registers
      4. 8.3.4 Device Status Registers
      5. 8.3.5 Input Deglitch Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Startup Mode
      2. 8.4.2 Normal (Conversion) Mode
      3. 8.4.3 Sleep Mode
      4. 8.4.4 Shutdown Mode
        1. 8.4.4.1 Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Specifications
    6. 8.6 Register Maps
      1. 8.6.1  Register List
      2. 8.6.2  Address 0x00, DATA_MSB_CH0
      3. 8.6.3  Address 0x01, DATA_LSB_CH0
      4. 8.6.4  Address 0x02, DATA_MSB_CH1
      5. 8.6.5  Address 0x03, DATA_LSB_CH1
      6. 8.6.6  Address 0x04, DATA_MSB_CH2 (LDC1614 only)
      7. 8.6.7  Address 0x05, DATA_LSB_CH2 (LDC1614 only)
      8. 8.6.8  Address 0x06, DATA_MSB_CH3 (LDC1614 only)
      9. 8.6.9  Address 0x07, DATA_LSB_CH3 (LDC1614 only)
      10. 8.6.10 Address 0x08, RCOUNT_CH0
      11. 8.6.11 Address 0x09, RCOUNT_CH1
      12. 8.6.12 Address 0x0A, RCOUNT_CH2 (LDC1614 only)
      13. 8.6.13 Address 0x0B, RCOUNT_CH3 (LDC1614 only)
      14. 8.6.14 Address 0x0C, OFFSET_CH0
      15. 8.6.15 Address 0x0D, OFFSET_CH1
      16. 8.6.16 Address 0x0E, OFFSET_CH2 (LDC1614 only)
      17. 8.6.17 Address 0x0F, OFFSET_CH3 (LDC1614 only)
      18. 8.6.18 Address 0x10, SETTLECOUNT_CH0
      19. 8.6.19 Address 0x11, SETTLECOUNT_CH1
      20. 8.6.20 Address 0x12, SETTLECOUNT_CH2 (LDC1614 only)
      21. 8.6.21 Address 0x13, SETTLECOUNT_CH3 (LDC1614 only)
      22. 8.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
      23. 8.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
      24. 8.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (LDC1614 only)
      25. 8.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (LDC1614 only)
      26. 8.6.26 Address 0x18, STATUS
      27. 8.6.27 Address 0x19, ERROR_CONFIG
      28. 8.6.28 Address 0x1A, CONFIG
      29. 8.6.29 Address 0x1B, MUX_CONFIG
      30. 8.6.30 Address 0x1C, RESET_DEV
      31. 8.6.31 Address 0x1E, DRIVE_CURRENT_CH0
      32. 8.6.32 Address 0x1F, DRIVE_CURRENT_CH1
      33. 8.6.33 Address 0x20, DRIVE_CURRENT_CH2 (LDC1614 only)
      34. 8.6.34 Address 0x21, DRIVE_CURRENT_CH3 (LDC1614 only)
      35. 8.6.35 Address 0x7E, MANUFACTURER_ID
      36. 8.6.36 Address 0x7F, DEVICE_ID
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Theory of Operation
        1. 9.1.1.1 Conductive Objects in an EM Field
        2. 9.1.1.2 L-C Resonators
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Recommended Initial Register Configuration Values
        2. 9.2.2.2 Inductor Self-Resonant Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Related Links
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

TI E2E Community : e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright© 2016, Texas Instruments Incorporated