SNOSCZ8 April   2016 LDC1612-Q1 , LDC1614-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics - I2C
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clocking Architecture
      2. 8.3.2 Multi-Channel and Single Channel Operation
      3. 8.3.3 Current Drive Control Registers
      4. 8.3.4 Device Status Registers
      5. 8.3.5 Input Deglitch Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Startup Mode
      2. 8.4.2 Normal (Conversion) Mode
      3. 8.4.3 Sleep Mode
      4. 8.4.4 Shutdown Mode
        1. 8.4.4.1 Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Specifications
    6. 8.6 Register Maps
      1. 8.6.1  Register List
      2. 8.6.2  Address 0x00, DATA_MSB_CH0
      3. 8.6.3  Address 0x01, DATA_LSB_CH0
      4. 8.6.4  Address 0x02, DATA_MSB_CH1
      5. 8.6.5  Address 0x03, DATA_LSB_CH1
      6. 8.6.6  Address 0x04, DATA_MSB_CH2 (LDC1614 only)
      7. 8.6.7  Address 0x05, DATA_LSB_CH2 (LDC1614 only)
      8. 8.6.8  Address 0x06, DATA_MSB_CH3 (LDC1614 only)
      9. 8.6.9  Address 0x07, DATA_LSB_CH3 (LDC1614 only)
      10. 8.6.10 Address 0x08, RCOUNT_CH0
      11. 8.6.11 Address 0x09, RCOUNT_CH1
      12. 8.6.12 Address 0x0A, RCOUNT_CH2 (LDC1614 only)
      13. 8.6.13 Address 0x0B, RCOUNT_CH3 (LDC1614 only)
      14. 8.6.14 Address 0x0C, OFFSET_CH0
      15. 8.6.15 Address 0x0D, OFFSET_CH1
      16. 8.6.16 Address 0x0E, OFFSET_CH2 (LDC1614 only)
      17. 8.6.17 Address 0x0F, OFFSET_CH3 (LDC1614 only)
      18. 8.6.18 Address 0x10, SETTLECOUNT_CH0
      19. 8.6.19 Address 0x11, SETTLECOUNT_CH1
      20. 8.6.20 Address 0x12, SETTLECOUNT_CH2 (LDC1614 only)
      21. 8.6.21 Address 0x13, SETTLECOUNT_CH3 (LDC1614 only)
      22. 8.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
      23. 8.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
      24. 8.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (LDC1614 only)
      25. 8.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (LDC1614 only)
      26. 8.6.26 Address 0x18, STATUS
      27. 8.6.27 Address 0x19, ERROR_CONFIG
      28. 8.6.28 Address 0x1A, CONFIG
      29. 8.6.29 Address 0x1B, MUX_CONFIG
      30. 8.6.30 Address 0x1C, RESET_DEV
      31. 8.6.31 Address 0x1E, DRIVE_CURRENT_CH0
      32. 8.6.32 Address 0x1F, DRIVE_CURRENT_CH1
      33. 8.6.33 Address 0x20, DRIVE_CURRENT_CH2 (LDC1614 only)
      34. 8.6.34 Address 0x21, DRIVE_CURRENT_CH3 (LDC1614 only)
      35. 8.6.35 Address 0x7E, MANUFACTURER_ID
      36. 8.6.36 Address 0x7F, DEVICE_ID
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Theory of Operation
        1. 9.1.1.1 Conductive Objects in an EM Field
        2. 9.1.1.2 L-C Resonators
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Recommended Initial Register Configuration Values
        2. 9.2.2.2 Inductor Self-Resonant Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Related Links
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

Avoid long traces to connect the sensor to the LDC. Short traces reduce parasitic capacitances between sensor inductor and offer higher system performance.

11.2 Layout Example

Figure 67 to Figure 70 show the LDC1612 evaluation module (EVM) layout.

LDC1612-Q1 LDC1614-Q1 lay01_top_signal_snoscy9.png Figure 67. Example PCB Layout: Top Layer (Signal)
LDC1612-Q1 LDC1614-Q1 lay02_mid1_GND_snoscy9.png Figure 68. Example PCB Layout: Mid-layer 1 (GND)
LDC1612-Q1 LDC1614-Q1 lay03_mid2_power_snoscy9.png Figure 69. Example PCB Layout: Mid-layer 2 (Power)
LDC1612-Q1 LDC1614-Q1 lay04_bot_signal_snoscy9.png Figure 70. Example PCB Layout: Bottom Layer (Signal)