SNOSCY9A December   2014  – March 2018 LDC1612 , LDC1614

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Measurement Precision vs. Target Distance
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics - I2C
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Multi-Channel and Single Channel Operation
      2. 7.3.2 Adjustable Conversion Time
      3. 7.3.3 Sensor Startup and Glitch Configuration
      4. 7.3.4 Reference Clock
      5. 7.3.5 Sensor Current Drive Control
      6. 7.3.6 Device Status Monitoring
    4. 7.4 Device Functional Modes
      1. 7.4.1 Startup Mode
      2. 7.4.2 Sleep Mode (Configuration Mode)
      3. 7.4.3 Normal (Conversion) Mode
      4. 7.4.4 Shutdown Mode
        1. 7.4.4.1 Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface Specifications
      2. 7.5.2 Pulses on I2C
      3. 7.5.3 Multi Register Data Readback
    6. 7.6 Register Maps
      1. 7.6.1  Register List
      2. 7.6.2  Address 0x00, DATA0_MSB
        1. Table 1. Address 0x00, DATA0_MSB Field Descriptions
      3. 7.6.3  Address 0x01, DATA0_LSB
        1. Table 2. Address 0x01 DATA0_LSB Field Descriptions
      4. 7.6.4  Address 0x02, DATA1_MSB
        1. Table 3. Address 0x02, DATA1_MSB Field Descriptions
      5. 7.6.5  Address 0x03, DATA1_LSB
        1. Table 4. Address 0x03, DATA1_LSB Field Descriptions
      6. 7.6.6  Address 0x04, DATA2_MSB (LDC1614 only)
        1. Table 5. Address 0x04, DATA2_MSB Field Descriptions
      7. 7.6.7  Address 0x05, DATA2_LSB (LDC1614 only)
        1. Table 6. Address 0x05 DATA2_LSB Field Descriptions
      8. 7.6.8  Address 0x06, DATA3_MSB (LDC1614 only)
        1. Table 7. Address 0x06, DATA3_MSB Field Descriptions
      9. 7.6.9  Address 0x07, DATA3_LSB (LDC1614 only)
        1. Table 8. Address 0x07 DATA3_LSB Field Descriptions
      10. 7.6.10 Address 0x08, RCOUNT0
        1. Table 9. Address 0x08, RCOUNT0 Field Descriptions
      11. 7.6.11 Address 0x09, RCOUNT1
        1. Table 10. Address 0x09, RCOUNT1 Field Descriptions
      12. 7.6.12 Address 0x0A, RCOUNT2 (LDC1614 only)
        1. Table 11. Address 0x0A, RCOUNT2 Field Descriptions
      13. 7.6.13 Address 0x0B, RCOUNT3 (LDC1614 only)
        1. Table 12. Address 0x0B, RCOUNT3 Field Descriptions
      14. 7.6.14 Address 0x0C, OFFSET0
        1. Table 13. OFFSET0 Field Descriptions
      15. 7.6.15 Address 0x0D, OFFSET1
        1. Table 14. Address 0x0D, OFFSET1 Field Descriptions
      16. 7.6.16 Address 0x0E, OFFSET2 (LDC1614 only)
        1. Table 15. Address 0x0E, OFFSET2 Field Descriptions
      17. 7.6.17 Address 0x0F, OFFSET3 (LDC1614 only)
        1. Table 16. Address 0x0F, OFFSET3 Field Descriptions
      18. 7.6.18 Address 0x10, SETTLECOUNT0
        1. Table 17. Address 0x10, SETTLECOUNT0 Field Descriptions
      19. 7.6.19 Address 0x11, SETTLECOUNT1
        1. Table 18. Address 0x11, SETTLECOUNT1 Field Descriptions
      20. 7.6.20 Address 0x12, SETTLECOUNT2 (LDC1614 only)
        1. Table 19. Address 0x12, SETTLECOUNT2 Field Descriptions
      21. 7.6.21 Address 0x13, SETTLECOUNT3 (LDC1614 only)
        1. Table 20. Address 0x13, SETTLECOUNT3 Field Descriptions
      22. 7.6.22 Address 0x14, CLOCK_DIVIDERS0
        1. Table 21. Address 0x14, CLOCK_DIVIDERS0 Field Descriptions
      23. 7.6.23 Address 0x15, CLOCK_DIVIDERS1
        1. Table 22. Address 0x15, CLOCK_DIVIDERS1 Field Descriptions
      24. 7.6.24 Address 0x16, CLOCK_DIVIDERS2 (LDC1614 only)
        1. Table 23. Address 0x16, CLOCK_DIVIDERS2 Field Descriptions
      25. 7.6.25 Address 0x17, CLOCK_DIVIDERS3 (LDC1614 only)
        1. Table 24. Address 0x17, CLOCK_DIVIDERS3
      26. 7.6.26 Address 0x18, STATUS
        1. Table 25. Address 0x18, STATUS Field Descriptions
      27. 7.6.27 Address 0x19, ERROR_CONFIG
        1. Table 26. Address 0x19, ERROR_CONFIG
      28. 7.6.28 Address 0x1A, CONFIG
        1. Table 27. Address 0x1A, CONFIG Field Descriptions
      29. 7.6.29 Address 0x1B, MUX_CONFIG
        1. Table 28. Address 0x1B, MUX_CONFIG Field Descriptions
      30. 7.6.30 Address 0x1C, RESET_DEV
        1. Table 29. Address 0x1C, RESET_DEV Field Descriptions
      31. 7.6.31 Address 0x1E, DRIVE_CURRENT0
        1. Table 30. Address 0x1E, DRIVE_CURRENT0 Field Descriptions
      32. 7.6.32 Address 0x1F, DRIVE_CURRENT1
        1. Table 31. Address 0x1F, DRIVE_CURRENT1 Field Descriptions
      33. 7.6.33 Address 0x20, DRIVE_CURRENT2 (LDC1614 only)
        1. Table 32. Address 0x20, DRIVE_CURRENT2 Field Descriptions
      34. 7.6.34 Address 0x21, DRIVE_CURRENT3 (LDC1614 only)
        1. Table 33. DRIVE_CURRENT3 Field Descriptions
      35. 7.6.35 Address 0x7E, MANUFACTURER_ID
        1. Table 34. Address 0x7E, MANUFACTURER_ID Field Descriptions
      36. 7.6.36 Address 0x7F, DEVICE_ID
        1. Table 35. Address 0x7F, DEVICE_ID Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Conductive Objects in a Time-Varying EM Field
      2. 8.1.2 L-C Resonators
      3. 8.1.3 Multi-Channel and Single Channel Operation
        1. 8.1.3.1 Data Offset
      4. 8.1.4 Sensor Conversion Time
        1. 8.1.4.1 Settling Time
        2. 8.1.4.2 Sensor Activation
      5. 8.1.5 Sensor Current Drive Configuration
        1. 8.1.5.1 Inactive Channel Sensor Connections
        2. 8.1.5.2 Automatic IDRIVE Setting with RP_OVERRIDE_EN
        3. 8.1.5.3 Determining Sensor IDRIVE for an Unknown Sensor RP Using an Oscilloscope
        4. 8.1.5.4 Sensor Auto-Calibration Mode
        5. 8.1.5.5 Channel 0 High Current Drive
      6. 8.1.6 Clocking Architecture
      7. 8.1.7 Input Deglitch Filter
      8. 8.1.8 Device Status Registers
      9. 8.1.9 Multi-Channel Data Readback
    2. 8.2 Typical Application
      1. 8.2.1 System Sensing Functionality
      2. 8.2.2 Example Application
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
      5. 8.2.5 Recommended Initial Register Configuration Values
      6. 8.2.6 Application Curves
      7. 8.2.7 Inductor Self-Resonant Frequency
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (December 2014) to A Revision

  • Changed ESD values from 1000 to 2000 and from 250 to 750 on both packages.Go
  • Added logic levels for ADDR, INTB, and SD pins.Go
  • Changed description of clocking architecture for improved clarity. Go
  • Changed register names and field names from CHx_NAME and NAME_CHx to NAMEx. Go
  • Added instructions on setting registers with both R and R/W fields.Go
  • Changed register names from DATA_MSB_CHx to DATAx_MSB; DATA_LSB_CHx register names to DATAx_LSB, and CHx_ERR_YY field names to ERR_YYx.Go
  • Changed ERR_AE field description on DATA_MSB_CH0, DATA_MSB_CH1, DATA_MSB_CH2 and DATA_MSB_CH3 tables.Go
  • Changed register names from RCOUNT_CHx to RCOUNTx; and CHx_RCOUNT field names to RCOUNTx Go
  • Changed register names from OFFSET_CHx to OFFSETx; and CHx_OFFSET field names to OFFSETx Go
  • Changed register names from SETTLECOUNT_CHx to SETTLECOUNTx; and CHx_SETTLECOUNT field names to SETTLECOUNTx Go
  • Changed Address of SETTLECOUNT0 and SETTLECOUNT1 were not correct on table. Go
  • Changed register names from CLOCK_DIVIDERS_CHx to CLOCK_DIVIDERSx; CHx_FIN_DIVIDER field names to FIN_DIVIDERx, and CHx_FREF_DIVIDER field names to FREF_DIVIDERx. Go
  • Changed CHx_UNREADCONV field names to UNREADCONVx Go
  • Changed register names from DRIVE_CURRENT_CHx to DRIVE_CURRENTx; CHx_IDRIVE field names to IDRIVEx, and CHx_INIT_IDRIVE to INIT_IDRIVEx Go
  • Changed Application Information section for clarity, and provided additional information on device configuration and operation. Go
  • Changed Equations in the L-C Resonators section.Go
  • Changed RP to RS in Equation Go
  • Changed IDRIVEx valuesGo
  • Added instructions for using an oscilloscope to configure sensor drive currentGo
  • Changed description of clocking architecture for improved clarity. Go
  • Changed description of clocking usage for clarity. Go
  • Changed reference frequency limits from < to ≤Go
  • Changed to a ≥ symbol in the Clock Configuration Requirements table. Go
  • Changed last bullet in the Design Requirements section. Go