SNOSDI7 December 2023 LDC5071-Q1
PRODUCTION DATA
The robustness of the system can be improved by implementing simple checks in software. The primary reason for this is to help with the loss of VCC or loss of GND fault condition.
Fault detection is typically done by measuring when the OUTx pins enter a Hi-Z state. This is done by adding pullup and pulldown resistors on the controller board. The ADC then measures if the OUTx signals ever exceed VOUT_FLT_HIGH or are below VOUT_FLT_LOW.
If a pullup resistor is used, a loss-of-VCC condition on the sensor board can cause a small leakage current (IOUT_NOVCC) path into the OUTx pin. If a pulldown resistor is used, a loss-of-GND condition on the sensor board can cause a leakage current path (IOUT_NOGND) into the OUTx pin. The leakage current value is controlled such that the OUTx pin voltages stay above VOUT_FLT_HIGH and below VOUT_FLT_LOW. However if certain application conditions cause the OUTx pin voltage outside the fault thresholds, TI recommends the following options to ensure that the MCU recognizes that a fault has occurred: