SNOSBH4E May   1998  – October 2015 LM10

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics LM10/LM10B
    5. 6.5 Electrical Characteristics, LM10C
    6. 6.6 Electrical Characteristics, LM10BL
    7. 6.7 Electrical Characteristics, LM10CL
    8. 6.8 Typical Characteristics
      1. 6.8.1 Typical Characteristics (Op Amp)
      2. 6.8.2 Typical Characteristics (Reference)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Common-Mode Voltage Range
      3. 7.3.3 Operational Amplifier
      4. 7.3.4 Voltage Reference
    4. 7.4 Device Functional Modes
      1. 7.4.1 Floating Mode
      2. 7.4.2 Linear Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Operational Amplifier Offset Adjustment
      2. 8.3.2 Positive Regulators
      3. 8.3.3 Reference and Internal Regulator
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Definition of Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Device Nomenclature

11.1.1.1 Definition of Terms

    Input offset voltage:That voltage which must be applied between the input terminals to bias the unloaded output in the linear region.
    Input offset current:The difference in the currents at the input terminals when the unloaded output is in the linear region.
    Input bias current:The absolute value of the average of the two input currents.
    Input resistance:The ratio of the change in input voltage to the change in input current on either input with the other grounded.
    Large signal voltage gain:The ratio of the specified output voltage swing to the change in differential input voltage required to produce it.
    Shunt gain:The ratio of the specified output voltage swing to the change in differential input voltage required to produce it with the output tied to the V+ terminal of the IC. The load and power source are connected between the V+ and V− terminals, and input common-mode is referred to the V− terminal.
    Common-mode rejection:The ratio of the input voltage range to the change in offset voltage between the extremes.
    Supply-voltage rejection:The ratio of the specified supply-voltage change to the change in offset voltage between the extremes.
    Line regulation:The average change in reference output voltage over the specified supply voltage range.
    Load regulation:The change in reference output voltage from no load to that load specified.
    Feedback sense voltage: The voltage, referred to V−, on the reference feedback terminal while operating in regulation.
    Reference amplifier gain:The ratio of the specified reference output change to the change in feedback sense voltage required to produce it.
    Feedback current: The absolute value of the current at the feedback terminal when operating in regulation.
    Supply current:The current required from the power source to operate the amplifier and reference with their outputs unloaded and operating in the linear range.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

AN-211 New Op Amp Ideas, SNOA638

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.