SNOSBH4E May   1998  – October 2015 LM10

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics LM10/LM10B
    5. 6.5 Electrical Characteristics, LM10C
    6. 6.6 Electrical Characteristics, LM10BL
    7. 6.7 Electrical Characteristics, LM10CL
    8. 6.8 Typical Characteristics
      1. 6.8.1 Typical Characteristics (Op Amp)
      2. 6.8.2 Typical Characteristics (Reference)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Common-Mode Voltage Range
      3. 7.3.3 Operational Amplifier
      4. 7.3.4 Voltage Reference
    4. 7.4 Device Functional Modes
      1. 7.4.1 Floating Mode
      2. 7.4.2 Linear Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Operational Amplifier Offset Adjustment
      2. 8.3.2 Positive Regulators
      3. 8.3.3 Reference and Internal Regulator
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Definition of Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

For best operational performance of the device, good printed-circuit board (PCB) layout practices are recommended. Low-loss, 0.1-uF bypass capacitors should be connected between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single-supply applications.

10.2 Layout Example

LM10 layout_example.gif Figure 72. Layout Example