SNVS729F September   2011  – August 2014 LM10506

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  General Electrical Characteristics
    6. 7.6  Buck 1 Electrical Characteristics
    7. 7.7  Buck 2 Electrical Characteristics
    8. 7.8  Buck 3 Electrical Characteristics
    9. 7.9  LDO Electrical Characteristics
    10. 7.10 Comparators Electrical Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1 Buck Regulators Operation
        1. 8.2.1.1 Buck Regulators Description
        2. 8.2.1.2 PWM Operation
        3. 8.2.1.3 PFM Operation (Bucks 1, 2 & 3)
        4. 8.2.1.4 Soft Start
        5. 8.2.1.5 Current Limiting
        6. 8.2.1.6 Internal Synchronous Rectification
        7. 8.2.1.7 Bypass FET Operation On Bucks 1 And 2
        8. 8.2.1.8 Low Dropout Operation
        9. 8.2.1.9 Out of Regulation
    3. 8.3 Device Functional Modes
      1. 8.3.1  Start-Up Sequence
      2. 8.3.2  Power-On Default And Device Enable
      3. 8.3.3  RESET Pin Function
      4. 8.3.4  Standby Function
        1. 8.3.4.1 STANDBY Pin
        2. 8.3.4.2 Standby Programming Via SPI
        3. 8.3.4.3 Standby Mode, Operational Constraints
      5. 8.3.5  HL_B2, HL_B3 Function
      6. 8.3.6  Undervoltage Lockout (UVLO)
      7. 8.3.7  Overvoltage Lockout (OVLO)
      8. 8.3.8  Interrupt Enable/Interrupt Status
      9. 8.3.9  Thermal Shutdown (TSD)
      10. 8.3.10 Comparator
    4. 8.4 Programming
      1. 8.4.1 SPI Data Interface
        1. 8.4.1.1 Registers Configurable via the SPI Interface
          1. 8.4.1.1.1 ADDR 0x07& 0x08: Buck 1 And Buck 2 Voltage Code And VOUT Level Mapping
          2. 8.4.1.1.2 ADDR 0x00 & 0x09: Buck 3 Voltage Code And VOUT Level Mapping
          3. 8.4.1.1.3 ADDR0x0B: Comparator Threshold Mapping
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Voltage
        2. 9.2.2.2 Standby Mode
        3. 9.2.2.3 External Components Selection
          1. 9.2.2.3.1 Output Inductors & Capacitors Selection
          2. 9.2.2.3.2 Inductor Selection
            1. 9.2.2.3.2.1 Recommended Method For Inductor Selection:
            2. 9.2.2.3.2.2 Alternate Method For Inductor Selection:
              1. 9.2.2.3.2.2.1 Suggested Inductors and Their Suppliers
            3. 9.2.2.3.2.3 Output And Input Capacitors Characteristics
              1. 9.2.2.3.2.3.1 Output Capacitor Selection
              2. 9.2.2.3.2.3.2 Input Capacitor Selection
        4. 9.2.2.4 Recommendations For Unused Functions And Pins
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Considerations
      2. 11.1.2 PCB Layout Thermal Dissipation For DSBGA Package
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Trademarks

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.