SNVS039J June   2000  – April 2015 LM1086

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ripple Rejection
      2. 7.3.2 Load Regulation
      3. 7.3.3 Overload Recovery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Voltage
      2. 7.4.2 Stability Consideration
      3. 7.4.3 Protection Diodes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  1.2-V to 15-V Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2  Adjustable at 5 V
      3. 8.2.3  5-V Regulator with Shutdown
      4. 8.2.4  Battery Charger
      5. 8.2.5  Adjustable Fixed Regulator
      6. 8.2.6  Regulator With Reference
      7. 8.2.7  High Current Lamp Driver Protection
      8. 8.2.8  Battery Backup Regulated Supply
      9. 8.2.9  Ripple Rejection Enhancement
      10. 8.2.10 Automatic Light Control
      11. 8.2.11 Remote Sensing
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Development Support
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
Maximum Input to Output Voltage Differential LM1086-ADJ 29 V
LM1086-1.8 27 V
LM1086-2.5 27 V
LM1086-3.3 27 V
LM1086-5.0 25 V
Power Dissipation(3) Internally Limited
Junction Temperature (TJ)(4) 150 °C
Lead Temperature 260, to 10 sec °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401).
(4) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations