SNVS774Q May   2004  – June 2020 LM117 , LM317-N

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Typical Application
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions, Metal Can Packages
    2.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information, LM117
    5. 7.5 Thermal Information, LM317-N
    6. 7.6 LM117 Electrical Characteristics
    7. 7.7 LM317-N Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Load Regulation
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Capacitors
      2. 8.4.2 Protection Diodes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1  1.25-V to 25-V Adjustable Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2  5-V Logic Regulator With Electronic Shutdown
      3. 9.2.3  Slow Turnon 15-V Regulator
      4. 9.2.4  Adjustable Regulator With Improved Ripple Rejection
      5. 9.2.5  High Stability 10-V Regulator
      6. 9.2.6  High-Current Adjustable Regulator
      7. 9.2.7  Emitter-Follower Current Amplifier
      8. 9.2.8  1-A Current Regulator
      9. 9.2.9  Common-Emitter Amplifier
      10. 9.2.10 Low-Cost 3-A Switching Regulator
      11. 9.2.11 Current-Limited Voltage Regulator
      12. 9.2.12 Adjusting Multiple On-Card Regulators With Single Control
      13. 9.2.13 AC Voltage Regulator
      14. 9.2.14 12-V Battery Charger
      15. 9.2.15 Adjustable 4-A Regulator
      16. 9.2.16 Current-Limited 6-V Charger
      17. 9.2.17 Digitally Selected Outputs
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
        1. 11.1.1.1 Heatsink Requirements
        2. 11.1.1.2 Heatsinking Surface Mount Packages
          1. 11.1.1.2.1 Heatsinking the SOT-223 (DCY) Package
          2. 11.1.1.2.2 Heatsinking the TO-263 (KTT) Package
          3. 11.1.1.2.3 Heatsinking the TO-252 (NDP) Package
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 LM317-N Electrical Characteristics(1)

Some specifications apply over full Operating Temperature Range as noted. Unless otherwise specified, TJ = 25°C, VIN − VOUT = 5 V, and IOUT = 10 mA.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Reference voltage TJ = 25°C 1.25 V
3 V ≤ (VIN − VOUT) ≤ 40 V,
10 mA ≤ IOUT ≤ IMAX(1) (over Full Operating Temperature Range)		 1.2 1.25 1.3 V
Line regulation 3V ≤ (VIN − VOUT) ≤ 40 V(2) TJ = 25°C 0.01 0.04 %/V
(over full operating temperature range) 0.02 0.07
Load regulation 10 mA ≤ IOUT ≤ IMAX(1)(2) TJ = 25°C 0.1% 0.5%
(over full operating temperature range) 0.3% 1.5%
Thermal regulation 20-ms pulse 0.04 0.07 %/W
Adjustment pin current (over full operating temperature range) 50 100 μA
Adjustment pin current change 10 mA ≤ IOUT ≤ IMAX(1)
3V ≤ (VIN − VOUT) ≤ 40V		 (over full operating temperature range) 0.2 5 μA
Temperature stability TMIN ≤ TJ ≤ TMAX (over full operating temperature range) 1%
Minimum load current (VIN − VOUT) = 40 V (over full operating temperature range) 3.5 10 mA
Current limit (VIN − VOUT) ≤ 15 V  TO-3, TO-263 Packages (over full operating temperature range) 1.5 2.2 3.4 A
SOT-223, TO-220 Packages (over full operating temperature range) 1.5 2.2 3.4
TO, TO-252 Package (over full operating temperature range) 0.5 0.8 1.8
(VIN − VOUT) = 40 V TO-3, TO-263 packages 0.15 0.4 A
SOT-223, TO-220 packages 0.15 0.4
TO, TO-252 package 0.075 0.2
RMS output noise, % of VOUT 10 Hz ≤ f ≤ 10 kHz 0.003%
Ripple rejection ratio VOUT = 10 V, f = 120 Hz, CADJ = 0 μF (over full operating temperature range) 65 dB
VOUT = 10V, f = 120 Hz, CADJ = 10 μF (over full operating temperature range) 66 80 dB
Long-term stability TJ = 125°C, 1000 hrs 0.3% 1%
(1) IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package.
IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum junction temperature (TJ), and package thermal resistance (RθJA). The maximum allowable power dissipation at any temperature is : PD(MAX) = ((TJ(MAX) – TA) / RθJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.