SNVSC25 October   2021 LM117HVQML-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Parameter Drift
    7. 7.7 Quality Conformance Inspection
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Simplified Device Schematic
    3. 8.3 Feature Description
      1. 8.3.1 Setting Output Voltage
      2. 8.3.2 Load Regulation
      3. 8.3.3 External Capacitors
      4. 8.3.4 Protection Diodes
  9. 9 Application and Implementation
    1. 9.1 Typical Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LM117HVQML-SP UNIT
TO-39 (NDT) CFP (NAC)

3 PINS

(LM117H)

16 PINS

(LM117GW)
R θJA Junction-to-ambient thermal resistance Still air 186 130 °C/W
500 LF/min air flow 64 80
R θJC(bot) Junction-to-case (bottom) thermal resistance 21 7 °C/W
(1) For more information, see the Semiconductor and IC package thermal metrics application report.