SNVSC25 October   2021 LM117HVQML-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Parameter Drift
    7. 7.7 Quality Conformance Inspection
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Simplified Device Schematic
    3. 8.3 Feature Description
      1. 8.3.1 Setting Output Voltage
      2. 8.3.2 Load Regulation
      3. 8.3.3 External Capacitors
      4. 8.3.4 Protection Diodes
  9. 9 Application and Implementation
    1. 9.1 Typical Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Power dissipation(2)Internally Limited
Input-output voltage differential–0.360V
TstgStorage temperature–65150°C
TjmaxMaximum junction temperature150°C
Lead temperature metal package300°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax – TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO-39 and CFP packages, and 20 W for the TO-3 package.