SNVSC12 April   2021 LM117QML-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: 0.5–A IOUT Devices (LM117H, LM117GW)
    6. 7.6  Parameter Drift: 0.5–A IOUT Devices (LM117H, LM117GW)
    7. 7.7  Electrical Characteristics: 1.5–A IOUT Devices (LM117K)
    8. 7.8  Parameter Drift: 1.5–A IOUT Devices (LM117K)
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Setting Output Voltage
    4. 8.4 External Capacitors
    5. 8.5 Load Regulation
    6. 8.6 Protection Diodes
  9. 9 Application and Implementation
    1. 9.1 Typical Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • K|2
  • NAC|16
  • Y|0
  • NDT|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)

PACKAGE

UNIT

TO-3 (K)

2 pin

(LM117K)

TO-39 (NDT)

3 pin

(LM117H)

CFP SOIC (NAC)

16 pin

(LM117GW)

R θJAJunction-to-ambient thermal resistanceStill air39186130°C/W
500 LF/min air flow146480
R θJC(bot)Junction-to-case (bottom) thermal resistance1.9217°C/W
(1) For more information, see the Semiconductor and IC package thermal metrics application report.