SNVS446D June   2006  – January 2016 LM1771

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Timing Opinion
      2. 7.3.2 Short-Circuit Protection
      3. 7.3.3 Precision Enable
      4. 7.3.4 Soft-Start
      5. 7.3.5 Jitter
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM1771 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Design Guide
            1. 8.2.1.2.1.1 Frequency Selection
            2. 8.2.1.2.1.2 Inductor Selection
            3. 8.2.1.2.1.3 Output Capacitor
            4. 8.2.1.2.1.4 Feedforward Capacitor
            5. 8.2.1.2.1.5 Input Capacitor
          2. 8.2.1.2.2 MOSFET Selection
            1. 8.2.1.2.2.1 VDS Voltage Rating
            2. 8.2.1.2.2.2 RDSON
            3. 8.2.1.2.2.3 Gate Drive
            4. 8.2.1.2.2.4 Gate Charge
            5. 8.2.1.2.2.5 Rise and Fall Times
            6. 8.2.1.2.2.6 Gate Charge Ratio
            7. 8.2.1.2.2.7 Feedback Resistors
          3. 8.2.1.2.3 Efficiency Calculations
            1. 8.2.1.2.3.1 Quiescent Current
            2. 8.2.1.2.3.2 Conduction Loss
            3. 8.2.1.2.3.3 Switching Loss
            4. 8.2.1.2.3.4 Transitional Loss
            5. 8.2.1.2.3.5 DCR Loss
            6. 8.2.1.2.3.6 Efficiency
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Example Application 5 VIN to 1.8 VOUT
      3. 8.2.3 Example Application 5 VIN to 3.3 VOUT
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.