SNVS671F February   2011  – May 2019 LM21212-1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Circuit
  4. 4 Revision History
  5. 5 Description
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Performance Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Frequency Synchronization
      2. 8.3.2 Precision Enable
      3. 8.3.3 UVLO
      4. 8.3.4 Current Limit
      5. 8.3.5 Short-Circuit Protection
      6. 8.3.6 Thermal Protection
      7. 8.3.7 Power-Good Flag
      8. 8.3.8 Light Load Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Custom Design With WEBENCH® Tools
        2. 9.2.1.2 Output Voltage
        3. 9.2.1.3 Precision Enable
        4. 9.2.1.4 Soft Start
        5. 9.2.1.5 Inductor Selection
        6. 9.2.1.6 Output Capacitor Selection
        7. 9.2.1.7 Input Capacitor Selection
        8. 9.2.1.8 Control Loop Compensation
      2. 9.2.2 Application Curves
  10. 10Layout
    1. 10.1 Pcb Layout Considerations
    2. 10.2 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With Webench® Tools
    2. 11.2 Receiving Notification Of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, And Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LM21212-1 UNIT
PWP (HTSSOP)
20 PINS
RθJA Junction-to-ambient thermal resistance (2) 24 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) Thermal measurements were performed on a 2 × 2 inch, 4 layer, 2 oz. copper outer layer, 1 oz .copper inner layer board with twelve 8 mil. vias underneith the EP of the device and an additional sixteen 8 mil. vias under the unexposed package.