SNVS586O September   2008  – November 2014 LM22673 , LM22673-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Handling Ratings: LM22673-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 UVLO
      2. 7.3.2 Soft-Start
      3. 7.3.3 Boot-Strap Supply
      4. 7.3.4 Internal Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Current Limit
      2. 7.4.2 Current-Limit Adjustment
      3. 7.4.3 Thermal Protection
      4. 7.4.4 Duty-Cycle Limits
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Divider Selection
      2. 8.1.2 Power Diode
    2. 8.2 Typical Application
      1. 8.2.1 Typical Buck Regulator Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Components
          2. 8.2.1.2.2 Inductor
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Boot-Strap Capacitor
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN to GND 43 V
SS, IADJ Pin Voltage –0.5 7 V
SW to GND(1) –5 VIN V
Boot Pin Voltage VSW + 7 V
FB Pin Voltage –0.5 7 V
Power Dissipation Internally Limited
Junction Temperature 150 °C
For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549).

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2 2 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Handling Ratings: LM22673-Q1

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) –2 2 kV
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN MAX UNIT
VIN Supply Voltage 4.5 42 V
Junction Temperature –40 125 °C

6.5 Thermal Information

THERMAL METRIC(1) LM22673 UNIT
DDA NDR
8 PINS 7 PINS
RθJA Junction-to-ambient thermal resistance 60 22 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6.6 Electrical Characteristics

Typical values represent the most likely parametric norm at TA = TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified: VIN = 12 V.
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
LM22673-5.0
VFB Feedback Voltage VIN = 8 V to 42 V 4.925 5.0 5.075 V
VIN = 8 V to 42 V, –40°C ≤ TJ ≤ 125°C 4.9 5.1
LM22673-ADJ
VFB Feedback Voltage VIN = 4.7 V to 42 V 1.266 1.285 1.304 V
VIN = 4.7 V to 42 V, –40°C ≤ TJ ≤ 125°C 1.259 1.311
ALL OUTPUT VOLTAGE VERSIONS
IQ Quiescent Current VFB = 5 V 3.4 mA
VFB = 5 V, –40°C ≤ TJ ≤ 125°C 6
VADJ Current Limit Adjust Voltage 0.8 V
–40°C ≤ TJ ≤ 125°C 0.65 0.9
ICL Current Limit 3.4 4.2 5.3 A
–40°C ≤ TJ ≤ 125°C 3.35 5.5
RDS(ON) Switch On-Resistance PFM Package 0.12 0.16 Ω
PFM Package, –40°C ≤ TJ ≤ 125°C 0.22
SO PowerPAD Package 0.10 0.16
SO PowerPAD Package, –40°C ≤ TJ ≤ 125°C 0.20
fO Oscillator Frequency 500 kHz
–40°C ≤ TJ ≤ 125°C 400 600
TOFFMIN Minimum Off-time 200 ns
–40°C ≤ TJ ≤ 125°C 100 300
TONMIN Minimum On-time 100 ns
IBIAS Feedback Bias Current VFB = 1.3 V (ADJ Version Only) 230 nA
ISS Soft-start Current EN Input = 0 V 50 µA
EN Input = 0 V, –40°C ≤ TJ ≤ 125°C 30 70
TSD Thermal Shutdown Threshold 150 °C
(1) The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns.
(2) Typical values represent most likely parametric norms at the conditions specified and are not ensured.
(3) MIN and MAX limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI's Average Outgoing Quality Level (AOQL).

6.7 Typical Characteristics

Vin = 12 V, TJ = 25°C (unless otherwise specified)
30076227.pngFigure 1. Efficiency vs IOUT and VIN
VOUT = 3.3 V
30076204.pngFigure 3. Normalized Switching Frequency vs Temperature
30076207.pngFigure 5. Normalized Feedback Voltage vs Temperature
30076209.pngFigure 7. Normalized Feedback Voltage vs Input Voltage
30076213.pngFigure 9. Current Limit vs IADJ Resistor
30076203.pngFigure 2. Current Limit vs Temperature
30076205.pngFigure 4. Feedback Bias Current vs Temperature
temp_v_rdson_nvs586.gifFigure 6. Normalized RDS(ON) vs Temperature
30076211.pngFigure 8. Soft-Start Current vs Temperature