6.1 Absolute Maximum Ratings(1)(2)
|
MIN |
MAX |
UNIT |
VIN to GND |
|
43 |
V |
EN Pin Voltage |
–0.5 |
6 |
SS, RT/SYNC Pin Voltage |
–0.5 |
7 |
SW to GND(3) |
–5 |
VIN |
BOOT Pin Voltage |
|
VSW + 7 |
FB Pin Voltage |
–0.5 |
7 |
Power Dissipation |
Internally Limited |
|
Junction Temperature(4) |
|
150 |
°C |
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the absolute-maximum-ratings or other conditions beyond those indicated in the
Recommended Operating Conditions is not implied. The
Recommended Operating Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications
(3) The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns.
(4) For soldering specifications, refer to Application Report
Absolute Maximum Ratings for Soldering (
SNOA549).
6.5 Thermal Information
THERMAL METRIC(1) |
LM22680, LM22680-Q1 |
UNIT |
DDA |
8 PINS |
RθJA |
Junction-to-ambient thermal resistance(2) |
60 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics application report (
SPRA953).
(2) The value of RθJA for the SO PowerPAD exposed pad (MR) package of 60°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer.
6.6 Electrical Characteristics
Typical values represent the most likely parametric norm at TA = TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified: VIN = 12 V.
PARAMETER |
CONDITIONS |
MIN(2) |
TYP(1) |
MAX(2) |
UNIT |
VFB |
Feedback Voltage |
VIN = 4.7 V to 42 V |
1.266 |
1.285 |
1.304 |
V |
VIN = 4.7 V to 42 V, –40°C ≤ TJ ≤ 125°C |
1.259 |
|
1.311 |
IQ |
Quiescent Current |
VFB = 5 V |
|
3.4 |
|
mA |
VFB = 5 V, –40°C ≤ TJ ≤ 125°C |
|
|
6 |
ISTDBY |
Standby Quiescent Current |
EN Pin = 0 V |
|
25 |
40 |
µA |
ICL |
Current Limit |
|
|
2.8 |
|
A |
–40°C ≤ TJ ≤ 125°C |
2.32 |
|
3.4 |
IL |
Output Leakage Current |
VIN = 42 V, EN Pin = 0 V, VSW = 0 V |
|
0.2 |
2 |
µA |
VSW = –1 V |
|
0.1 |
3 |
µA |
RDS(ON) |
Switch On-Resistance |
|
|
0.2 |
0.24 |
Ω |
–40°C ≤ TJ ≤ 125°C |
|
|
0.32 |
fO |
Oscillator Frequency |
|
|
500 |
|
kHz |
–40°C ≤ TJ ≤ 125°C |
400 |
|
600 |
TOFFMIN |
Minimum Off-time |
|
|
200 |
|
ns |
–40°C ≤ TJ ≤ 125°C |
100 |
|
300 |
TONMIN |
Minimum On-time |
|
|
100 |
|
ns |
IBIAS |
Feedback Bias Current |
VFB = 1.3 V |
|
230 |
|
nA |
VEN |
Enable Threshold Voltage |
Falling |
|
1.6 |
|
V |
Falling, –40°C ≤ TJ ≤ 125°C |
1.3 |
|
1.9 |
VENHYST |
Enable Voltage Hysteresis |
|
|
0.6 |
|
V |
IEN |
Enable Input Current |
EN Input = 0 V |
|
6 |
|
µA |
FSYNC |
Maximum Synchronization Frequency |
VSYNC = 3.5 V, 50% duty-cycle |
|
1 |
|
MHz |
VSYNC |
Synchronization Threshold Voltage |
|
|
1.75 |
|
V |
ISS |
Soft-Start Current |
|
|
50 |
|
µA |
–40°C ≤ TJ ≤ 125°C |
30 |
|
70 |
TSD |
Thermal Shutdown Threshold |
|
|
150 |
|
°C |
(1) Typical values represent most likely parametric norms at the conditions specified and are not ensured.
(2) MIN and MAX limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI's Average Outgoing Quality Level (AOQL).