SNVS617H April   2009  – November 2014 LM25011 , LM25011-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings: LM25011
    3. 6.3 Handling Ratings: LM25011-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 On-Time Timer
      3. 7.3.3 Current Limit
      4. 7.3.4 Ripple Requirements
      5. 7.3.5 N-Channel Buck Switch and Driver
      6. 7.3.6 Soft-Start
      7. 7.3.7 Power Good Output (PGD)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Function
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LM25011 Example Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH Tools
          2. 8.2.1.2.2 External Components
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Output Ripple Control
        1. 8.2.2.1 Option A: Lowest Cost Configuration
        2. 8.2.2.2 Option B: Intermediate VOUT Ripple Configuration
        3. 8.2.2.3 Option C: Minimum VOUT Ripple Configuration
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1) HVSSOP (DGQ) UNIT
10 PINS
RθJA Junction-to-ambient thermal resistance 48 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.3
RθJB Junction-to-board thermal resistance 34.2
ψJT Junction-to-top characterization parameter 4.0
ψJB Junction-to-board characterization parameter 33.9
RθJC(bot) Junction-to-case (bottom) thermal resistance 10
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.