SNVSC10 March   2022 LM25143

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Input Voltage Range (VIN)
      2. 9.3.2  High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA)
      3. 9.3.3  Enable (EN1, EN2)
      4. 9.3.4  Power-Good Monitor (PG1, PG2)
      5. 9.3.5  Switching Frequency (RT)
      6. 9.3.6  Clock Synchronization (DEMB)
      7. 9.3.7  Synchronization Out (SYNCOUT)
      8. 9.3.8  Spread Spectrum Frequency Modulation (DITH)
      9. 9.3.9  Configurable Soft Start (SS1, SS2)
      10. 9.3.10 Output Voltage Setpoint (FB1, FB2)
      11. 9.3.11 Minimum Controllable On Time
      12. 9.3.12 Error Amplifier and PWM Comparator (FB1, FB2, COMP1, COMP2)
      13. 9.3.13 Slope Compensation
      14. 9.3.14 Inductor Current Sense (CS1, VOUT1, CS2, VOUT2)
        1. 9.3.14.1 Shunt Current Sensing
        2. 9.3.14.2 Inductor DCR Current Sensing
      15. 9.3.15 Hiccup Mode Current Limiting (RES)
      16. 9.3.16 High-Side and Low-Side Gate Drivers (HO1/2, LO1/2, HOL1/2, LOL1/2)
      17. 9.3.17 Output Configurations (MODE, FB2)
        1. 9.3.17.1 Independent Dual-Output Operation
        2. 9.3.17.2 Single-Output Interleaved Operation
        3. 9.3.17.3 Single-Output Multiphase Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Standby Modes
      2. 9.4.2 Diode Emulation Mode
      3. 9.4.3 Thermal Shutdown
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Power Train Components
        1. 10.1.1.1 Buck Inductor
        2. 10.1.1.2 Output Capacitors
        3. 10.1.1.3 Input Capacitors
        4. 10.1.1.4 Power MOSFETs
        5. 10.1.1.5 EMI Filter
      2. 10.1.2 Error Amplifier and Compensation
    2. 10.2 Typical Applications
      1. 10.2.1 Design 1 – 5-V and 3.3-V Dual-Output Buck Regulator for Computing Applications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 10.2.1.2.2 Custom Design With Excel Quickstart Tool
          3. 10.2.1.2.3 Inductor Calculation
          4. 10.2.1.2.4 Current-Sense Resistance
          5. 10.2.1.2.5 Output Capacitors
          6. 10.2.1.2.6 Input Capacitors
          7. 10.2.1.2.7 Compensation Components
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Design 2 – Two-Phase, 15-A, 2.1-MHz Single-Output Buck Regulator for Server Applications
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Design 3 – Two-Phase, 50-A, 300-kHz Single-Output Buck Regulator for ASIC Power Applications
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Power Stage Layout
      2. 12.1.2 Gate-Drive Layout
      3. 12.1.3 PWM Controller Layout
      4. 12.1.4 Thermal Design and Layout
      5. 12.1.5 Ground Plane Design
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Development Support
        1. 13.1.2.1 Custom Design With WEBENCH® Tools
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
        1. 13.2.1.1 PCB Layout Resources
        2. 13.2.1.2 Thermal Design Resources
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Hiccup Mode Current Limiting (RES)

The LM25143 includes an optional hiccup mode protection function that is enabled when a capacitor is connected to the RES pin. In normal operation, the RES capacitor is discharged to ground. If 512 cycles of cycle-by-cycle current limiting occurs, SS is pulled low and the HO and LO outputs are disabled (see Figure 9-6). A 20-μA current source begins to charge the RES capacitor. When the RES voltage increases to 1.2 V, RES is pulled low and the SS capacitor begins to charge. The 512-cycle hiccup counter is reset if four consecutive switching cycles occur without exceeding the current limit threshold. Separate hiccup counters are provided for each channel, but the RES pin is shared by both channels. One channel can be in hiccup protection while the other operates normally. In the event that both channels are in an overcurrent condition triggering hiccup protection, the last hiccup counter to expire pulls RES low and starts the RES capacitor charging cycle. Both channels then restart together when VRES = 1.2 V. If RES is connected to VDDA at power up, the hiccup function is disabled for both channels.

Figure 9-6 Hiccup Mode Timing Diagram

Use Equation 13 to calculate the RES capacitance.

Equation 13. GUID-E41DC22D-0243-4964-9111-5C1494260471-low.gif

where

  • tRES is the specified hiccup delay as shown in Figure 9-6.