SNVSB89A November   2018  – July 2019 LM25180-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Typical Efficiency, VOUT = 5 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Integrated Power MOSFET
      2. 7.3.2  PSR Flyback Modes of Operation
      3. 7.3.3  Setting the Output Voltage
        1. 7.3.3.1 Diode Thermal Compensation
      4. 7.3.4  Control Loop Error Amplifier
      5. 7.3.5  Precision Enable
      6. 7.3.6  Configurable Soft Start
      7. 7.3.7  External Bias Supply
      8. 7.3.8  Minimum On-Time and Off-Time
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Wide VIN, Low IQ PSR Flyback Converter Rated at 5 V, 1 A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Custom Design With Excel Quickstart Tool
          3. 8.2.1.2.3  Flyback Transformer – T1
          4. 8.2.1.2.4  Flyback Diode – DFLY
          5. 8.2.1.2.5  Zener Clamp Circuit – DF, DCLAMP
          6. 8.2.1.2.6  Output Capacitor – COUT
          7. 8.2.1.2.7  Input Capacitor – CIN
          8. 8.2.1.2.8  Feedback Resistor – RFB
          9. 8.2.1.2.9  Thermal Compensation Resistor – RTC
          10. 8.2.1.2.10 UVLO Resistors – RUV1, RUV2
          11. 8.2.1.2.11 Soft-Start Capacitor – CSS
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2: PSR Flyback Converter With Dual Outputs of 15 V and –7.7 V at 200 mA
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Flyback Transformer – T1
          2. 8.2.2.2.2 Flyback Diodes – DFLY1 and DFLY2
          3. 8.2.2.2.3 Input Capacitor – CIN
          4. 8.2.2.2.4 Feedback Resistor – RFB
          5. 8.2.2.2.5 UVLO Resistors – RUV1, RUV2
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Design 3: PSR Flyback Converter With Stacked Dual Outputs of 24 V and 5 V
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Flyback Transformer – T1
          2. 8.2.3.2.2 Feedback Resistor – RFB
          3. 8.2.3.2.3 UVLO Resistors – RUV1, RUV2
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
      3. 11.1.3 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NGU|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.