SNVSBJ4A April   2020  – September 2020 LM25183-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Integrated Power MOSFET
      2. 7.3.2  PSR Flyback Modes of Operation
      3. 7.3.3  Setting the Output Voltage
        1. 7.3.3.1 Diode Thermal Compensation
      4. 7.3.4  Control Loop Error Amplifier
      5. 7.3.5  Precision Enable
      6. 7.3.6  Configurable Soft Start
      7. 7.3.7  External Bias Supply
      8. 7.3.8  Minimum On-Time and Off-Time
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Wide VIN, Low IQ PSR Flyback Converter Rated at 12 V, 0.6 A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Custom Design With Excel Quickstart Tool
          3. 8.2.1.2.3  Flyback Transformer – T1
          4. 8.2.1.2.4  Flyback Diode – DFLY
          5. 8.2.1.2.5  Leakgae Inductance Clamp Circuit – DF, DCLAMP
          6. 8.2.1.2.6  Output Capacitor – COUT
          7. 8.2.1.2.7  Input Capacitor – CIN
          8. 8.2.1.2.8  Feedback Resistor – RFB
          9. 8.2.1.2.9  Thermal Compensation Resistor – RTC
          10. 8.2.1.2.10 UVLO Resistors – RUV1, RUV2
          11. 8.2.1.2.11 Soft-Start Capacitor – CSS
          12.        50
      2. 8.2.2 Application Curves
      3. 8.2.3 Design 2: PSR Flyback Converter With Dual Outputs of 15 V and –15 V at 0.3 A
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Flyback Transformer – T1
          2. 8.2.3.2.2 Flyback Diodes – DFLY1 and DFLY2
          3. 8.2.3.2.3 Input Capacitor – CIN
          4. 8.2.3.2.4 Output Capacitors – COUT1, COUT2
          5. 8.2.3.2.5 Feedback Resistor – RFB
          6. 8.2.3.2.6 Thermal Compensation Resistor – RTC
          7. 8.2.3.2.7 Output Voltage Clamp Zeners – DOUT1 and DOUT2
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN to GND –0.3 45 V
EN/UVLO to GND –0.3 45
TC to GND –0.3 6
SS/BIAS to GND –0.3 14
FB to GND –0.3 45.3
FB to VIN –0.3 0.3
RSET to GND –0.3 3
Output voltage SW to GND –1.5 70 V
SW to GND (20-ns transient) –3
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.