SNVSB28 December   2017 LM25575-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Application Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage Start-Up Regulator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown and Stand-by Mode
      2. 7.4.2 Error Amplifier and PWM Comparator
      3. 7.4.3 Ramp Generator
      4. 7.4.4 Maximum Duty Cycle and Input Drop-out Voltage
      5. 7.4.5 Current Limit
      6. 7.4.6 Soft-Start
      7. 7.4.7 Boost Pin
      8. 7.4.8 Thermal Protection
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  External Components
      2. 8.1.2  R3 (RT)
      3. 8.1.3  L1
      4. 8.1.4  C3 (CRAMP)
      5. 8.1.5  C9, C10
      6. 8.1.6  D1
      7. 8.1.7  C1, C2
      8. 8.1.8  C8
      9. 8.1.9  C7
      10. 8.1.10 C4
      11. 8.1.11 R5, R6
      12. 8.1.12 R1, R2, C12
      13. 8.1.13 R7, C11
      14. 8.1.14 R4, C5, C6
      15. 8.1.15 BIas Power Dissipation Reduction
    2. 8.2 Typical Application
      1. 8.2.1 Typical Schematic for High Frequency (1 MHz) Application
  9. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PCB Layout and Thermal Considerations
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Developmental Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

BIas Power Dissipation Reduction

Buck regulators operating with high input voltage can dissipate an appreciable amount of power for the bias of the IC. The VCC regulator must step-down the input voltage VIN to a nominal VCC level of 7 V. The large voltage drop across the VCC regulator translates into a large power dissipation within the VCC regulator. There are several techniques that can significantly reduce this bias regulator power dissipation. Figure 14 and Figure 15 depict two methods to bias the IC from the output voltage. In each case the internal VCC regulator is used to initially bias the VCC pin. After the output voltage is established, the VCC pin potential is raised above the nominal 7 V regulation level, which effectively disables the internal VCC regulator. The voltage applied to the VCC pin should never exceed 14 V. The VCC voltage should never be larger than the VIN voltage.

LM25575-Q1 20212118.gifFigure 14. VCC Bias From VOUT For 8 V < VOUT < 14 V
LM25575-Q1 20212119_nvs479.gifFigure 15. VCC Bias With Additional Winding on the Output Inductor