SNVS470H January   2007  – August 2017 LM25576

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage Start-Up Regulator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown and Stand-by Mode
      2. 7.4.2 Oscillator and Sync Capability
      3. 7.4.3 Error Amplifier and PWM Comparator
      4. 7.4.4 RAMP Generator
      5. 7.4.5 Maximum Duty Cycle and Input Drop-Out Voltage
      6. 7.4.6 Current Limit
      7. 7.4.7 Soft-Start
      8. 7.4.8 Boost Pin
      9. 7.4.9 Thermal Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  External Components
      2. 8.1.2  R3 (RT)
      3. 8.1.3  L1
      4. 8.1.4  C3 (CRAMP)
      5. 8.1.5  C9, C10
      6. 8.1.6  D1
      7. 8.1.7  C1, C2
      8. 8.1.8  C8
      9. 8.1.9  C7
      10. 8.1.10 C4
      11. 8.1.11 R5, R6
      12. 8.1.12 R1, R2, C12
      13. 8.1.13 R7, C11
      14. 8.1.14 R4, C5, C6
      15. 8.1.15 Bias Power Dissipation Reduction
    2. 8.2 Typical Application
      1. 8.2.1 Typical Schematic for High Frequency (1 MHz) Application
      2. 8.2.2 Typical Schematic for Buck and Boost (Inverting) Application
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Custom Design With WEBENCH® Tools
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PCB Layout and Thermal Considerations
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Developmental Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (March 2009) to G Revision

  • Changed layout of National Data Sheet to TI format Go

Changes from G Revision (April 2013) to H Revision

  • Added Application and Implementation section, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go