SLVS569F January   2005  – August 2015 LM2575

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Feedback Connection
      2. 7.3.2 ON/OFF Input
      3. 7.3.3 Fault Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation Mode
      2. 7.4.2 Standby Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Input Capacitor (CIN)
        2. 8.2.2.2  Output Capacitor (COUT)
        3. 8.2.2.3  Catch Diode
        4. 8.2.2.4  Inductor
        5. 8.2.2.5  Output Voltage Ripple and Transients
        6. 8.2.2.6  Feedback Connection
        7. 8.2.2.7  ON/OFF Input
        8. 8.2.2.8  Grounding
        9. 8.2.2.9  Reverse Current Considerations
        10. 8.2.2.10 Buck Regulator Design Procedure
        11. 8.2.2.11 Inductor Selection Guide
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (January 2006) to F Revision

  • ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go