SNVS121E May   1996  – May 2019 LM2586

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Typical Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configurations
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: 3.3 V
    6. 6.6 Electrical Characteristics: 5 V
    7. 6.7 Electrical Characteristics: 12 V
    8. 6.8 Electrical Characteristics: Adjustable
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flyback Regulator Operation
      2. 7.3.2 Step-Up (Boost) Regulator Operation
      3. 7.3.3 Programming Output Voltage (Selecting R1 And R2)
      4. 7.3.4 Shutdown Control
      5. 7.3.5 Frequency Adjustment
      6. 7.3.6 Frequency Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Flyback Regulator Applications
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Transformer Selection (T)
          2. 8.2.1.1.2 Transformer Footprints
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Flyback Regulator Input Capacitors
          3. 8.2.1.2.3 Switch Voltage Limits
          4. 8.2.1.2.4 Output Voltage Limitations
          5. 8.2.1.2.5 Noisy Input Line Condition
          6. 8.2.1.2.6 Stability
      2. 8.2.2 Typical Boost Regulator Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 System Examples
      1. 8.3.1 Test Circuits
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Heat Sink/Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings (4)(1)

Input Voltage −0.4V ≤ VIN ≤ 45V
Switch Voltage −0.4V ≤ VSW ≤ 65V
Switch Current (2) Internally Limited
Compensation Pin Voltage −0.4V ≤ VCOMP ≤ 2.4V
Feedback Pin Voltage −0.4V ≤ VFB ≤ 2 VOUT
ON /OFF Pin Voltage −0.4V ≤ VSH ≤ 6V
Sync Pin Voltage −0.4V ≤ VSYNC ≤ 2V
Power Dissipation (3) Internally Limited
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C
Maximum Junction Temperature (3) 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. These ratings apply when the current is limited to less than 1.2 mA for pins 1, 2, 3, and 6. Operating ratings indicate conditions for which the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the Electrical Characteristics.
(2) Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the LM2586 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 3A. However, output current is internally limited when the LM2586 is used as a flyback regulator (see the section for more information).
(3) The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance (θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction temperature of the device: PD × θJA + TA(MAX) ≥ TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the device is less than: PD ≤ [TJ(MAX) − TA(MAX)]/θJA. When calculating the maximum allowable power dissipation, derate the maximum junction temperature—this ensures a margin of safety in the thermal design.
(4) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.