SNVS121E May   1996  – May 2019 LM2586

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Typical Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configurations
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: 3.3 V
    6. 6.6 Electrical Characteristics: 5 V
    7. 6.7 Electrical Characteristics: 12 V
    8. 6.8 Electrical Characteristics: Adjustable
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flyback Regulator Operation
      2. 7.3.2 Step-Up (Boost) Regulator Operation
      3. 7.3.3 Programming Output Voltage (Selecting R1 And R2)
      4. 7.3.4 Shutdown Control
      5. 7.3.5 Frequency Adjustment
      6. 7.3.6 Frequency Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Flyback Regulator Applications
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Transformer Selection (T)
          2. 8.2.1.1.2 Transformer Footprints
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Flyback Regulator Input Capacitors
          3. 8.2.1.2.3 Switch Voltage Limits
          4. 8.2.1.2.4 Output Voltage Limitations
          5. 8.2.1.2.5 Noisy Input Line Condition
          6. 8.2.1.2.6 Stability
      2. 8.2.2 Typical Boost Regulator Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 System Examples
      1. 8.3.1 Test Circuits
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Heat Sink/Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM2585 UNIT
KTW (DDPAK/TO-263 NDZ (TO-220)
7 PINS 7 PINS
RθJA Junction-to-ambient thermal resistance 56(2) 65(3) °C/W
35(4) 45(5)
26(6) —
RθJC Junction-to-case thermal resistance 2 2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(3) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area.
(4) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(5) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(6) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance further.