SLOS068AB June   1976  – October 2024 LM158 , LM158A , LM258 , LM258A , LM2904 , LM2904B , LM2904BA , LM2904V , LM358 , LM358A , LM358B , LM358BA

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: LM358B and LM358BA
    6. 5.6  Electrical Characteristics: LM2904B and LM2904BA
    7. 5.7  Electrical Characteristics: LM358, LM358A
    8. 5.8  Electrical Characteristics: LM2904, LM2904V
    9. 5.9  Electrical Characteristics: LM158, LM158A
    10. 5.10 Electrical Characteristics: LM258, LM258A
    11. 5.11 Typical Characteristics: LM358B and LM2904B
    12. 5.12 Typical Characteristics: LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram: LM358B, LM358BA, LM2904B, LM2904BA
    3. 7.3 Feature Description
      1. 7.3.1 Unity-Gain Bandwidth
      2. 7.3.2 Slew Rate
      3. 7.3.3 Input Common-Mode Range
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V(2) LM158, LM158A UNIT
D
(SOIC)		 DGK
(VSSOP)		 P
(PDIP)		 PS
(SO)		 PW
(TSSOP)		 DDF
(SOT-23)		 FK
(LCCC)		 JG
(CDIP)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 8PINS 20 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 124.7 181.4 80.9 116.9 171.7 164.3 84.0 112.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.9 69.4 70.4 62.5 68.8 98.1 56.9 63.6 °C/W
RθJB Junction-to-board thermal resistance 67.9 102.9 57.4 68.6 99.2 82.1 57.5 100.3 °C/W
ψJT Junction-to-top characterization parameter 19.2 11.8 40 21.9 11.5 11.4 51.7 35.7 °C/W
ψJB Junction-to-board characterization parameter 67.2 101.2 56.9 67.6 97.9 81.7 57.1 93.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — — 10.6 22.3 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Section 3.