SNIS115S May   2001  – September 2015 LM26

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Hysteresis
      2. 8.3.2 VTEMP Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 After Assembly PCB Testing
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input Voltage 6 V
Input Current at any pin (2) 5 mA
Package Input Current (2) 20 mA
Package Dissipation at TA = 25°C(3) 500 mW
Soldering Information(4)   SOT-23 Package    Vapor Phase (60 seconds)    215 °C
Infrared (15 seconds) 220
Storage Temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow:
(4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge(1) Human body model (HBM) ±2500 V
Machine Model ±250
(1) The human body model is a 100-pF capacitor discharge through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Specified Temperature Range (TMIN ≤ TA ≤ TMAX) −55 125 °C
Positive Supply Voltage (V+) 2.7 5.5 V
Maximum VOUT 5.5 V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

7.4 Thermal Information

THERMAL METRIC(1) LM26 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 250 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

The following specifications apply for V+ = 2.7 VDC to 5.5 VDC, and VTEMP load current = 0 µA unless otherwise specified. All limits apply for TA = TJ = TMIN to TMAX unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(2)  TYP(1) MAX(2) UNIT
TEMPERATURE SENSOR
Trip Point Accuracy (Includes VREF, DAC, Comparator Offset, and Temperature Sensitivity errors) –55°C ≤ TA ≤ +110°C ±3 °C
TA = +120°C ±4 °C
Trip Point Hysteresis HYST = GND 11 °C
HYST = V+ 2 °C
VTEMP Output Temperature Sensitivity −10.82 mV/°C
VTEMP Temperature Sensitivity Error to Equation:

VO = (−3.479 × 10−6 × (T − 30)2) +
(−1.082 × 10−2 × (T − 30)) + 1.8015 V

  		−30°C ≤ TA ≤ 120°C ±3 °C
−55°C ≤ TA ≤ 120°C, 4.5 V ≤ V+ ≤ 5.5 V ±3 °C
TA = 30°C ±2.5 °C
VTEMP Load Regulation Source ≤ 1 μA 0.070 mV
Sink ≤ 40 μA 0.7 mV
VTEMP Line Regulation +2.7 V ≤ V+ ≤ +5.5 V,
−30°C ≤ TA ≤ +120°C		 −0.2 mV/V
IS Supply Current TA = 25°C 16 20 µA
40
DIGITAL OUTPUT AND INPUT
IOUT(1) Logical 1 Output Leakage Current (4) TA = 25°C V+ = +5.0 V 0.001 1 µA
VOUT(0) Logical 0 Output Voltage IOUT = +1.2 mA and V+ ≥ 2.7 V; IOUT = +3.2 mA and V+ ≥ 4.5 V(3) 0.4 V
VOUT(1) Logical 1 Push-Pull Output Voltage ISOURCE = 500 µA, V+ ≥ 2.7 V 0.8 × V+ V
ISOURCE = 800 µA, V+≥ 4.5 V V+ − 1.5 V
VIH HYST Input Logical 1 Threshold Voltage 0.8 × V+ V
VIL HYST Input Logical 0 Threshold Voltage 0.2 × V+ V
(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
(3) Take care to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would increase by 1.28 mW when IOUT = 3.2 mA and VOUT = 0.4 V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification.
(4) The 1-µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15°C increase in temperature. For example, the 1-nA typical current at 25°C would increase to 16 nA at 85°C.

7.6 Typical Characteristics

LM26 C001_SNIS115.gif
Figure 1. Power Supply Current Temperature Dependence