SNVSAO5 October   2017 LM2623-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gated Oscillator Control Scheme
      2. 7.3.2 Cycle-To-Cycle PFM
      3. 7.3.3 Shutdown
      4. 7.3.4 Internal Current Limit and Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Frequency Modulation (PFM)
      2. 7.4.2 Low Voltage Start-Up
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Non-Linear Effect
        2. 8.2.2.2 Choosing the Correct C3 Capacitor
        3. 8.2.2.3 Setting the Output Voltage
        4. 8.2.2.4 VDD Supply
        5. 8.2.2.5 Setting the Switching Frequency
        6. 8.2.2.6 Output Diode Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Boost Input / VDD Capacitor Placement
    2. 10.2 Layout Example
    3. 10.3 WSON Package Devices
  11. 11Device And Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, And Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
Input pins SW pin voltage –0.5 14.5 V
BOOT, VDD, EN, and FB pins –0.5 10 V
FREQ pin 100 µA
Power dissipation (TA = 25°C)(3) 500 mW
TJ_MAX (3) 150 °C
Storage temperature, Tstg –55 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and specifications.
The maximum power dissipation must be derated at elevated temparters and is dictated by TJ-MAX (maximum junction temperature), RΘJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD-MAX = (TJ-MAX – TA)/RΘJA or the number given in the Absolute Maximum Rating, whichever is lower.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) All pins except 12 and 13 ±2000 V
Pins 12 and 13 ±1000
Charged device model (CDM), per AEC Q100-011 ±500
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Input pins VDD pin 3 5 V
FB and EN pins 0 VDD V
BOOT pin 0 10 V
Operating junction temperature range, TJ –40 125 °C

Thermal Information

THERMAL METRIC(1) LM2623-Q1 UNIT
NHL (WSON)
14 PINS
RθJA Junction-to-ambient thermal resistance 37.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.9 °C/W
RθJB Junction-to-board thermal resistance 15.0 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 4.7 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Electrical Characteristics

Limits apply for TJ = 25°C and VDD = VOUT = 3.3 V, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
GENERAL
VDD_ST Start-up supply voltage 25°C ILOAD = 0 mA(1) 1.1 V
VIN_OP Minimum operating supply voltage (once started) ILOAD = 0 mA 0.65 0.9 V
VFB FB pin voltage 1.24 V
–40°C to 85°C 1.2028 1.2772
–40°C to 125°C 1.2028 1.2772
VOUT_MAX Maximum output voltage 14 V
η Efficiency VIN = 3.6 V; VOUT = 5 V, ILOAD = 500 mA 87%
VIN = 2.5 V; VOUT = 3.3 V, ILOAD = 200 mA 87%
D Switch duty cycle 17%
IDD Operating quiescent current(2) FB pin > 1.3 V, EN pin at VDD 80 µA
FB pin > 1.3 V, EN pin at VDD , –40°C to 85°C 110
FB pin > 1.3 V, EN pin at VDD, –40°C to 125°C 110
ISD Shutdown quiescent current(3) VDD, BOOT, and SW pins at 5 V, EN pin < 200 mV 0.01 µA
VDD, BOOT, and SW pins at 5 V, EN pin < 200 mV, –40°C to 85°C 2.5
VDD, BOOT, and SW pins at 5 V, EN pin < 200 mV, –40°C to 125°C 2.5
ICL Switch peak current limit 2.2 2.85 A
RDSON MOSFET switch on resistance 0.17 Ω
 –40°C to 85°C 0.26
–40°C to 125° 0.26
ENABLE SECTION
VEN_LO EN pin voltage low(4) –40°C to 85°C 0.15 VDD V
–40°C to 125°C 0.15 VDD
VEN_HI EN pin voltage high(4) –40°C to 85°C 0.7 VDD V
–40°C to 125°C 0.7 VDD
VDD tied to BOOT and EN pins. Frequency pin tied to VDD through 121-KΩ resistor. VDD_ST = VDD when start-up occurs. VIN is VDD + D1 voltage (usually 10 mV to 50 mV at start-up).
This is the current into the VDD pin.
This is the total current into pins VDD, BOOT, SW, and FREQ.
When the EN pin is below VEN_LO, the regulator is shut down; when it is above VEN_HI, the regulator is operating.

Typical Characteristics

LM2623-Q1 D006_SNVSA_VIN_Efficiency.gif
VOUT = 5 V
Figure 1. Efficiency vs Supply Voltage
LM2623-Q1 D005_SNVSA_VIN_Frequency.gif
Figure 3. Frequency vs VIN
LM2623-Q1 D003_SNVSAO5_RDSon_Temp.gif
Figure 5. Typical RDS(ON) vs Temperature
LM2623-Q1 20038844.png
VOUT = 5 V
Figure 7. Output Voltage vs Supply Voltage
LM2623-Q1 D002_SNVSAO5_Feedback_Temp.gif
Figure 2. VFB vs Temperature
LM2623-Q1 D003_SNVSAO5_VDD_Start_Temp.gif
Figure 4. Maximum Start-Up Voltage vs Temperature
LM2623-Q1 D001_SNVSAO5_Current_Limit_Temp.gif
Figure 6. Typical Current Limit vs Temperature