SNVSB35C May   2018  – November 2024 LM26420-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics Per Buck
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Soft Start
      2. 6.3.2 Power Good
      3. 6.3.3 Precision Enable
    4. 6.4 Device Functional Modes
      1. 6.4.1 Output Overvoltage Protection
      2. 6.4.2 Undervoltage Lockout
      3. 6.4.3 Current Limit
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Programming Output Voltage
      2. 7.1.2 VINC Filtering Components
      3. 7.1.3 Using Precision Enable and Power Good
      4. 7.1.4 Overcurrent Protection for HTSSOP-20 Package
      5. 7.1.5 Current Limit and Short-Circuit Protection for WQFN-16 Package
    2. 7.2 Typical Applications
      1. 7.2.1 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Inductor Selection
          3. 7.2.1.2.3 Input Capacitor Selection
          4. 7.2.1.2.4 Output Capacitor
          5. 7.2.1.2.5 Calculating Efficiency and Junction Temperature
        3. 7.2.1.3 Application Curves
      2. 7.2.2 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 LM26420-Q12.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Recommendations - HTSSOP-20 Package
      2. 7.3.2 Power Supply Recommendations - WQFN-16 Package
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Method 1: Silicon Junction Temperature Determination
        2. 7.4.3.2 Thermal Shutdown Temperature Determination
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision B (June 2020) to Revision C (November 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed PMOS and NMOS into MOS throughout the documentGo
  • Changed Parameter UVLO VIN Rising for WQFN-16 Package: TYP value from 2.628V to 2.75V Go
  • Changed Parameter UVLO VIN Falling for WQFN-16 Package: TYP value from 2.3V to 2.5V. Go
  • Changed Parameter UVLO hysteresis for WQFN-16 Package: TYP value from 330mV to 260mV Go
  • Added HTSSOP-20 Package to TEST CONDITIONS for Parameter FFB Go
  • Changed Parameter ICL_BOT for WQFN-16 Package: TYP value from 0.75A to 1.0AGo
  • Changed parameter IQVINC VINC Quiescent Current (non-switching) with both outputs on: TEST CONDITION VFB from 0.9V to 0.95V Go
  • Changed Parameter IQVIND VIND Quiescent Current (non-switching): TEST CONDITION VFB from 0.9V to 0.95VGo
  • Updated the power-good thresholds in the functional block diagram for the HTSSOP-20 package to match with electrical characteristicsGo
  • Added functional block diagram for the WQFN-16 packageGo
  • Added typical undervoltage lockout threshold values for the WQFN-16 packageGo
  • Changed ±10% into ±15% in the note which describes the usage of PG1 to control VOUT2 Go
  • Changed ±14% into ±15% in the sentence describing the power-good thresholdGo
  • Updated Figure 7-6 Go
  • Updated the title of section to Current Limit and Short-Circuit Protection for HTSSOP-20 Package Go
  • Added new section, Current Limit and Short-Circuit Protection for WQFN-16 Package Go
  • Added C6 in Figure 7-7 in accordance with Table 7-2 Go
  • Changed VOUT2 in Figure 7-7 from 1.8V into 0.8VGo
  • Changed VOUT1 in Figure 7-7 from 3.3V into 1.8VGo
  • Changed minimum for VIN in Figure 7-7 from 4.5V into 3V Go
  • Changed 550 kHz into 2.2MHz in the sentence describing internal power-loss calculation and in Table 7-3 Go
  • Added separate Power Supply Recommendations sub-sections for HTSSOP-20 package and WQFN-16 packageGo

Changes from Revision A (July 2019) to Revision B (June 2020)