SNVSA58C January   2015  – November 2017 LM26480-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Tables
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: Bucks
    4. 7.4  Thermal Information
    5. 7.5  General Electrical Characteristics
    6. 7.6  Low Dropout Regulators, LDO1 and LDO2
    7. 7.7  Buck Converters SW1, SW2
    8. 7.8  I/O Electrical Characteristics
    9. 7.9  Power-On Reset Threshold/Function (POR)
    10. 7.10 Typical Characteristics — LDO
    11. 7.11 Typical Characteristics — Buck 2.8 V to 5.5 V
    12. 7.12 Typical Characteristics — Bucks 1 and 2
    13. 7.13 Typical Characteristics — Buck 3.6 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DC-DC Converters
        1. 8.3.1.1 Linear Low Dropout Regulators (LDOs)
          1. 8.3.1.1.1 No-Load Stability
        2. 8.3.1.2 SW1, SW2: Synchronous Step-Down Magnetic DC-DC Converters
          1. 8.3.1.2.1  Functional Description
          2. 8.3.1.2.2  Circuit Operation Description
          3. 8.3.1.2.3  PWM Operation
          4. 8.3.1.2.4  Internal Synchronous Rectification
          5. 8.3.1.2.5  Current Limiting
          6. 8.3.1.2.6  PFM Operation
          7. 8.3.1.2.7  SW1, SW2 Control
          8. 8.3.1.2.8  Shutdown Mode
          9. 8.3.1.2.9  Soft Start
          10. 8.3.1.2.10 Low Dropout Operation
          11. 8.3.1.2.11 Flexible Power-On Reset (Power Good with Delay)
          12. 8.3.1.2.12 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 External Component Selection
      2. 9.1.2 Feedback Resistors for LDOs
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 High VIN- High Load Operation
        2. 9.2.1.2 Junction Temperature
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Output Inductors and Capacitors for SW1 AND SW2
          1. 9.2.2.2.1 Inductor Selection for SW1 and SW2
          2. 9.2.2.2.2 Suggested Inductors and Their Suppliers
        3. 9.2.2.3 Output Capacitor Selection for SW1 and SW2
        4. 9.2.2.4 Input Capacitor Selection for SW1 and SW2
        5. 9.2.2.5 LDO Capacitor Selection
          1. 9.2.2.5.1 Input Capacitor
          2. 9.2.2.5.2 Output Capacitor
          3. 9.2.2.5.3 Capacitor Characteristics
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Custom Design With WEBENCH® Tools
      2. 12.2.2 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Device Support

Third-Party Products Disclaimer

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Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

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Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.