SNVS543N January   2008  – June 2017 LM26480

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: Bucks
    4. 7.4  Thermal Information
    5. 7.5  General Electrical Characteristics
    6. 7.6  Low Dropout Regulators, LDO1 and LDO2
    7. 7.7  Buck Converters SW1, SW2
    8. 7.8  I/O Electrical Characteristics
    9. 7.9  Power On Reset Threshold/Function (POR)
    10. 7.10 Typical Characteristics — LDO
    11. 7.11 Typical Characteristics — Buck 2.8 V to 5.5 V
    12. 7.12 Typical Characteristics — Bucks 1 and 2
    13. 7.13 Typical Characteristics — Buck 3.6 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DC-DC Converters
        1. 8.3.1.1 Linear Low Dropout Regulators (LDOs)
          1. 8.3.1.1.1 No-Load Stability
        2. 8.3.1.2 SW1, SW2: Synchronous Step-Down Magnetic DC-DC Converters
          1. 8.3.1.2.1  Functional Description
          2. 8.3.1.2.2  Circuit Operation Description
          3. 8.3.1.2.3  Sync Function
          4. 8.3.1.2.4  PWM Operation
          5. 8.3.1.2.5  Internal Synchronous Rectification
          6. 8.3.1.2.6  Current Limiting
          7. 8.3.1.2.7  PFM Operation
          8. 8.3.1.2.8  SW1, SW2 Control
          9. 8.3.1.2.9  Shutdown Mode
          10. 8.3.1.2.10 Soft Start
          11. 8.3.1.2.11 Low Dropout Operation
          12. 8.3.1.2.12 Flexible Power-On Reset (Power Good with Delay)
          13. 8.3.1.2.13 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 External Component Selection
      2. 9.1.2 Feedback Resistors for LDOs
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 High VIN- High Load Operation
        2. 9.2.1.2 Junction Temperature
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductors and Capacitors for SW1 AND SW2
          1. 9.2.2.1.1 Inductor Selection for SW1 and SW2
          2. 9.2.2.1.2 Suggested Inductors and Their Suppliers
        2. 9.2.2.2 Output Capacitor Selection for SW1 and SW2
        3. 9.2.2.3 Input Capacitor Selection for SW1 and SW2
        4. 9.2.2.4 LDO Capacitor Selection
          1. 9.2.2.4.1 Input Capacitor
          2. 9.2.2.4.2 Output Capacitor
          3. 9.2.2.4.3 Capacitor Characteristics
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation, see the following:

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.