SNVS036K April   2000  – June 2016 LM2670

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - 3.3 V
    6. 6.6 Electrical Characteristics - 5 V
    7. 6.7 Electrical Characteristics - 12 V
    8. 6.8 Electrical Characteristics - All Output Voltage Versions
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switch Output
      2. 7.3.2 Input
      3. 7.3.3 C Boost
      4. 7.3.4 Ground
      5. 7.3.5 SYNC
      6. 7.3.6 Feedback
      7. 7.3.7 ON/OFF
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Design Considerations
      2. 8.1.2 Inductor
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitor
      5. 8.1.5 Catch Diode
      6. 8.1.6 Boost Capacitor
      7. 8.1.7 Sync Components
      8. 8.1.8 Additional Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application for All Output Voltage Versions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitor Selection Guides
          2. 8.2.1.2.2 Inductor Selection Guides
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Fixed Output Voltage Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Capacitor Selection Guides
      3. 8.2.3 Adjustable Output Voltage Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Capacitor Selection Guides
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 DAP (VSON Package)

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

See (1)(2)
MIN MAX UNIT
Input supply voltage 45 V
Soft-start pin voltage –0.1 6 V
Switch voltage to ground(3) –1 VIN V
Boost pin voltage VSW + 8 V
Feedback pin voltage –0.3 14 V
Power dissipation Internally Limited
Soldering temperature Wave, 4 s 260 °C
Infrared, 10 s 240
Vapor phase, 75 s 219
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) The absolute maximum specification of the Switch Voltage to Ground applies to DC voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 20 ns, –6 V of 60 ns and –3 V of up to 100 ns.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) ESD was applied using the human-body model, a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

6.3 Recommended Operating Conditions

MIN MAX UNIT
Supply voltage 8 40 V
Junction temperature, TJ –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM2678 UNIT
NDZ (TO-220) KTW (TO-263) NHM (VSON)
7 PINS 7 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance See (2) 65 — — °C/W
See (3) 45 — —
See (4) — 56 —
See (5) — 35 —
See (6) — 26 —
See (7) — — 55
See (8) — — 29
RθJC(top) Junction-to-case (top) thermal resistance 2 2 — °C/W
(1) For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal Metrics.
(2) Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PCB with minimum copper area.
(3) Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads soldered to a PCB containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(4) Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB area of 0.136 square inches (the same size as the DDPAK package) of 1 oz (0.0014 in thick) copper.
(5) Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB area of 0.4896 square inches (3.6 times the area of the DDPAK package) of 1 oz (0.0014 in thick) copper.
(6) Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB copper area of 1.0064 square inches (7.4 times the area of the DDPAK 3 package) of 1 oz (0.0014 in thick) copper. Additional copper area will reduce thermal resistance further.
(7) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PCB copper area equal to the die attach paddle.
(8) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PCB copper area using 12 vias to a second layer of copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, see Application Note AN-1187 Leadless Leadfram Package (LLP).

6.5 Electrical Characteristics – 3.3 V

Specifications apply for TA = TJ = 25°C unless otherwise noted. RADJ = 5.6 kΩ.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VOUT Output voltage VIN = 8 V to 40 V,
100 mA ≤ IOUT ≤ 5 A 		3.234 3.3 3.366 V
over the entire junction temperature range of operation –40°C to 125°C 3.201 3.399
η Efficiency VIN = 12 V, ILOAD = 5 A 86%
(1) All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are specified through correlation using standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.6 Electrical Characteristics – 5 V

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VOUT Output voltage VIN = 8 V to 40 V,
100 mA ≤ IOUT ≤ 5 A 		4.9 5 5.1 V
over the entire junction temperature range of operation –40°C to 125°C 4.85 5.15
η Efficiency VIN = 12 V, ILOAD = 5 A 88%
(1) All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are specified through correlation using standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.7 Electrical Characteristics – 12 V

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VOUT Output voltage VIN = 15 V to 40 V,
100 mA ≤ IOUT ≤ 5 A 		11.76 12 12.24 V
over the entire junction temperature range of operation –40°C to 125°C 11.64 12.36
η Efficiency VIN = 24 V, ILOAD = 5 A 94%
(1) All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are specified through correlation using standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.8 Electrical Characteristics – All Output Voltage Versions

Specifications are for TA = TJ = 25°C unless otherwise specified. Unless otherwise specified VIN = 12 V for the 3.3 V, 5 V and Adjustable versions, and VIN = 24 V for the 12 V version.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DEVICE PARAMETERS
IQ Quiescent current VFEEDBACK = 8 V for 3.3-V, 5-V, and ADJ versions,
VFEEDBACK = 15 V for 12-V Versions		 4.2 6 mA
ISTBY Standby quiescent current ON/OFF pin = 0 V 50 100 µA
over the entire junction temperature range of operation –40°C to 125°C 150
ICL Current limit 3.8 4.5 5.25 A
over the entire junction temperature range of operation –40°C to 125°C 3.6 5.4
IL Output leakage current VIN = 40 V,
soft-start pin = 0 V		 VSWITCH = 0 V 200 µA
VSWITCH = –1 V 16 15 mA
RDS(ON) Switch ON-resistance ISWITCH = 5 A 0.15 0.17 Ω
over the entire junction temperature range of operation –40°C to 125°C 0.29
fO Oscillator frequency Measured at
switch pin		 260 kHz
over the entire junction temperature range of operation –40°C to 125°C 225 280
D Duty cycle Maximum duty cycle 91%
Minimum duty cycle 0%
IBIAS Feedback bias current VFEEDBACK = 1.3 V, ADJ version only 85 nA
VON/OFF ON/OFF threshold voltage 1.4 V
over the entire junction temperature range of operation –40°C to 125°C 0.8 2
ION/OFF ON/OFF input current ON/OFF pin = 0 V 20 µA
over the entire junction temperature range of operation –40°C to 125°C 45
FSYNC Synchronization frequency VSYNC (pin 5) = 3.5 V, 50% duty cycle 400 kHz
VSYNC SYNC threshold voltage 1.4 V

6.9 Typical Characteristics

LM2670 10094209.png Figure 1. Normalized Output Voltage
LM2670 10094211.png Figure 3. Efficiency vs Input Voltage
LM2670 10094204.png Figure 5. Switch Current Limit
LM2670 10094240.png Figure 7. Standby Quiescent Current
LM2670 10094214.png Figure 9. ON/OFF Pin Current (Sourcing)
LM2670 10094216.png
Figure 11. Feedback Pin Bias Current
LM2670 10094218.png
Discontinuous Mode Switching Waveforms VIN = 20 V,
VOUT = 5 V, ILOAD = 500 mA L = 10 µH, COUT = 400 µF,
COUTESR = 13 mΩ
A: VSW Pin Voltage, 10 V/div
B: Inductor Current, 1 A/div
C: Output Ripple Voltage, 20 mV/div AC-Coupled
Figure 13. Horizontal Time Base: 1 µs/div
LM2670 10094220.png
Load Transient Response for Discontinuous Mode VIN = 20 V, VOUT = 5 V, L = 10 µH, COUT = 400 µF, COUTESR = 13 mΩ
A: Output Voltage, 100 mV/div, AC-Coupled
B: Load Current: 200-mA to 3-A Load Pulse
Figure 15. Horizontal Time Base: 200 µs/div
LM2670 10094210.png Figure 2. Line Regulation
LM2670 10094212.png Figure 4. Efficiency vs ILOAD
LM2670 10094205.png Figure 6. Operating Quiescent Current
LM2670 10094213.png Figure 8. ON/OFF Threshold Voltage
LM2670 10094215.png Figure 10. Switching Frequency
LM2670 10094217.png
Continuous Mode Switching Waveforms VIN = 20 V, VOUT = 5 V, ILOAD = 3 A, L = 33 µH, COUT = 200 µF, COUTESR = 26 mΩ
A: VSW Pin Voltage, 10 V/div
B: Inductor Current, 1 A/div
C: Output Ripple Voltage, 20 mV/div AC-Coupled
Figure 12. Horizontal Time Base: 1 µs/div
LM2670 10094219.png
Load Transient Response for Continuous Mode VIN = 20 V,
VOUT = 5 V L = 33 µH, COUT = 200 µF,
COUTESR = 26 mΩ
A: Output Voltage, 100 mV//div, AC-Coupled
B: Load Current: 500-mA to 3-A Load Pulse
Figure 14. Horizontal Time Base: 100 µs/div