SNVS136L September   1998  – June 2016 LM2672

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - 3.3 V
    6. 7.6  Electrical Characteristics - 5 V
    7. 7.7  Electrical Characteristics - 12 V
    8. 7.8  Electrical Characteristics - Adjustable
    9. 7.9  Electrical Characteristics - All Output Voltage Versions
    10. 7.10 Typical Characteristics
    11. 7.11 Typical Characteristics - Fixed Output Voltage Versions
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Switch Output
      2. 9.3.2 C Boost
      3. 9.3.3 SYNC
      4. 9.3.4 Feedback
    4. 9.4 Device Functional Modes
      1. 9.4.1 ON/OFF
      2. 9.4.2 Shutdown Mode
      3. 9.4.3 Active Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application for Fixed Output Voltage Versions
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Inductor Selection (L1)
          2. 10.2.1.2.2 Output Capacitor Selection (COUT)
          3. 10.2.1.2.3 Catch Diode Selection (D1)
          4. 10.2.1.2.4 Input Capacitor (CIN)
          5. 10.2.1.2.5 Boost Capacitor (CB)
          6. 10.2.1.2.6 Soft-Start Capacitor (CSS, Optional)
          7. 10.2.1.2.7 Frequency Synchronization (Optional)
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical Application for Adjustable Output Voltage Versions
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Programming Output Voltage
          2. 10.2.2.2.2 Inductor Selection (L1)
          3. 10.2.2.2.3 Output Capacitor SeIection (COUT)
          4. 10.2.2.2.4 Catch Diode Selection (D1)
          5. 10.2.2.2.5 Input Capacitor (CIN)
          6. 10.2.2.2.6 Boost Capacitor (CB)
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 WSON Package Devices
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 DAP (WSON Package)

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

14.1 DAP (WSON Package)

The die attach pad (DAP) must be connected to the PCB ground plane. For CAD and assembly guidelines, refer to AN-1187 Leadless Leadframe Package (LLP).