SNVS031M april   2000  – may 2023 LM2676

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: LM2676 – 3.3 V
    6. 6.6  Electrical Characteristics: LM2676 – 5 V
    7. 6.7  Electrical Characteristics: LM2676 – 12 B
    8. 6.8  Electrical Characteristics: LM2676 – Adjustable
    9. 6.9  Electrical Characteristics – All Output Voltage Versions
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switch Output
      2. 7.3.2 Input
      3. 7.3.3 C Boost
      4. 7.3.4 Ground
      5. 7.3.5 Feedback
      6. 7.3.6 ON/OFF
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Design Considerations
      2. 8.1.2 Inductor
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitor
      5. 8.1.5 Catch Diode
      6. 8.1.6 Boost Capacitor
      7. 8.1.7 Additional Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application for All Output Voltage Versions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitor Selection Guides
          2. 8.2.1.2.2 Inductor Selection Guides
      2. 8.2.2 Application Curves
      3. 8.2.3 Fixed Output Voltage Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Capacitor Selection
      4. 8.2.4 Adjustable Output Voltage Application
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 Capacitor Selection
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 DAP (VSON Package)

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 DAP (VSON Package)

The Die Attach Pad (DAP) can and must be connected to PCB Ground plane or island. For CAD and assembly guidelines refer to Application Note AN-1187 at www.ti.com/lsds/ti/analog/powermanagement/power_portal.page.