SNVS153F May   2001  – September 2016 LM2698

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductor
      2. 7.3.2 Current Limit
      3. 7.3.3 Diode
      4. 7.3.4 Input Capacitor
      5. 7.3.5 Output Capacitor
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.25-MHz Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Compensation
            1. 8.2.1.2.1.1 Quick Compensator Design
            2. 8.2.1.2.1.2 Improving Transient Response Time
            3. 8.2.1.2.1.3 Additional Comments on the Open Loop Frequency Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 3.3-V SEPIC
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Level-Shifted SEPIC
        1. 8.2.3.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The output power of the LM2698 is limited by its maximum power dissipation. The maximum power dissipation is determined by Equation 25.

Equation 25. PD = (Tjmax – TA) / RθJA

where

  • Tjmax is the maximum specified junction temperature (125°C)
  • TA is the ambient temperature
  • RθJA is the thermal resistance of the package

RθJA is dependant on the layout of the board as shown in Layout Examples.