SNIS144G July   2007  – September 2016 LM26LV , LM26LV-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM26LV
    3. 6.3 ESD Ratings: LM26LV-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Accuracy Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM26LV and LM26LV-Q1 VTEMP vs Die Temperature Conversion Table
      2. 7.3.2 VTEMP vs Die Temperature Approximations
        1. 7.3.2.1 The Second-Order Equation (Parabolic)
        2. 7.3.2.2 The First-Order Approximation (Linear)
        3. 7.3.2.3 First-Order Approximation (Linear) Over Small Temperature Range
      3. 7.3.3 OVERTEMP and OVERTEMP Digital Outputs
        1. 7.3.3.1 OVERTEMP Open-Drain Digital Output
          1. 7.3.3.1.1 Determining the Pullup Resistor Value
            1. 7.3.3.1.1.1 Example Calculation
      4. 7.3.4 TRIP_TEST Digital Input
      5. 7.3.5 VTEMP Analog Temperature Sensor Output
        1. 7.3.5.1 Noise Considerations
        2. 7.3.5.2 Capacitive Loads
        3. 7.3.5.3 Voltage Shift
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Noise Immunity
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Mounting and Temperature Conductivity
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.