SNIS144G July   2007  – September 2016 LM26LV , LM26LV-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM26LV
    3. 6.3 ESD Ratings: LM26LV-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Accuracy Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM26LV and LM26LV-Q1 VTEMP vs Die Temperature Conversion Table
      2. 7.3.2 VTEMP vs Die Temperature Approximations
        1. 7.3.2.1 The Second-Order Equation (Parabolic)
        2. 7.3.2.2 The First-Order Approximation (Linear)
        3. 7.3.2.3 First-Order Approximation (Linear) Over Small Temperature Range
      3. 7.3.3 OVERTEMP and OVERTEMP Digital Outputs
        1. 7.3.3.1 OVERTEMP Open-Drain Digital Output
          1. 7.3.3.1.1 Determining the Pullup Resistor Value
            1. 7.3.3.1.1.1 Example Calculation
      4. 7.3.4 TRIP_TEST Digital Input
      5. 7.3.5 VTEMP Analog Temperature Sensor Output
        1. 7.3.5.1 Noise Considerations
        2. 7.3.5.2 Capacitive Loads
        3. 7.3.5.3 Voltage Shift
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Noise Immunity
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Mounting and Temperature Conductivity
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (February 2013) to G Revision

  • Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Thermal Information table, Switching Characteristics table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Updated values in the Thermal Information table to align with JEDEC standardsGo

Changes from E Revision (February 2013) to F Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo