SNIS151C August   2008  – January 2024 LM26NV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 LM26NV Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Feature Description
      1. 6.2.1 LM26NV OPTIONS
      2. 6.2.2 Output Pin Options Block Diagrams
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Noise Considerations
      2. 7.1.2 Mounting Considerations
    2. 7.2 Typical Applications
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

See(1)
Input Voltage6.0V
Input Current at any pin (2)5mA
Package Input Current(2)20mA
Package Dissipation at TA = 25°C(3)
500mW
Soldering Information(4)  
SOT-23 PackageVapor Phase (60 seconds)215°C
Infrared (15 seconds)220°C
Storage Temperature−65°C to + 150°C
ESD Susceptibility (5)  Human Body Model  2500V
Machine Model250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow:
(4) See the URL ”http://www.ti.com/packaging“ for other recommendations and methods of soldering surface mount devices.
(5) The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin.