SNVSB80 September 2018 LM2734-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | LM2734-Q1 | UNIT | |
---|---|---|---|
DDC (SOT-23-THIN) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 158.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 46.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 29.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 29.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |