SNVSB73 September   2018 LM2735-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Boost Application Circuit
      2.      Efficiency vs Load Current VO = 12 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Soft Start
      4. 7.3.4 Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  LM2735X-Q1 SOT-23 Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Setting the Output Voltage
        3. 8.2.1.3 Application Curves
      2. 8.2.2  LM2735Y-Q1 SOT-23 Design Example 2
      3. 8.2.3  LM2735X-Q1 WSON Design Example 3
      4. 8.2.4  LM2735Y-Q1 WSON Design Example 4
      5. 8.2.5  LM2735X-Q1 SOT-23 Design Example 6
      6. 8.2.6  LM2735Y-Q1 SOT-23 Design Example 7
      7. 8.2.7  LM2735X-Q1 SOT-23 Design Example 8
      8. 8.2.8  LM2735Y-Q1 SOT-23 Design Example 9
      9. 8.2.9  LM2735X-Q1 WSON Design Example 10
      10. 8.2.10 LM2735Y-Q1 WSON Design Example 11
      11. 8.2.11 LM2735X-Q1 WSON SEPIC Design Example 12
      12. 8.2.12 LM2735X-Q1 SOT-23 LED Design Example 14
      13. 8.2.13 LM2735Y-Q1 WSON FlyBack Design Example 15
      14. 8.2.14 LM2735X-Q1 SOT-23 LED Design Example 16 VRAIL > 5.5 V Application
      15. 8.2.15 LM2735X-Q1 SOT-23 LED Design Example 17 Two-Input Voltage Rail Application
      16. 8.2.16 SEPIC Converter
        1. 8.2.16.1 Detailed Design Procedure
          1. 8.2.16.1.1 SEPIC Design Guide
          2. 8.2.16.1.2 Small Ripple Approximation
          3. 8.2.16.1.3 Steady State Analysis With Loss Elements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 WSON Package
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Definitions
      2. 10.3.2 PCB Design With Thermal Performance in Mind
      3. 10.3.3 LM2735-Q1 Thermal Models
      4. 10.3.4 Calculating Efficiency, and Junction Temperature
        1. 10.3.4.1 Example Efficiency Calculation
      5. 10.3.5 Calculating RθJA and RΨJC
        1. 10.3.5.1 Procedure
        2. 10.3.5.2 Example From Previous Calculations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Custom Design With WEBENCH® Tools
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3.5 Calculating RθJA and RΨJC

Equation 60. LM2735-Q1 20215855.gif

Now the internal power dissipation is known, and the junction temperature is attempted to be kept at or below 125°C. The next step is to calculate the value for RθJA and/or RψJC. This is actually very simple to accomplish, and necessary if marginality is a possibility in regards to thermals or determining what package option is correct.

The LM2735-Q1 has a thermal shutdown comparator. When the silicon reaches a temperature of 160°C, the device shuts down until the temperature reduces to 150°C. Knowing this, the RθJA or the RψJC of a specific application can be calculated. Because the junction-to-top case thermal impedance is much lower than the thermal impedance of junction to ambient air, the error in calculating RψJC is lower than for RθJA . However, a small thermocouple must be attached onto the top case of the LM2735-Q1 to obtain the RψJC value.

Knowing the temperature of the silicon when the device shuts down allows three of the four variables to be known. Once the thermal impedance is calculated, work backwards with the junction temperature set to 125°C to determine what maximum ambient air temperature keeps the silicon below the 125°C temperature.