SNVSB73 September   2018 LM2735-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Boost Application Circuit
      2.      Efficiency vs Load Current VO = 12 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Soft Start
      4. 7.3.4 Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  LM2735X-Q1 SOT-23 Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Setting the Output Voltage
        3. 8.2.1.3 Application Curves
      2. 8.2.2  LM2735Y-Q1 SOT-23 Design Example 2
      3. 8.2.3  LM2735X-Q1 WSON Design Example 3
      4. 8.2.4  LM2735Y-Q1 WSON Design Example 4
      5. 8.2.5  LM2735X-Q1 SOT-23 Design Example 6
      6. 8.2.6  LM2735Y-Q1 SOT-23 Design Example 7
      7. 8.2.7  LM2735X-Q1 SOT-23 Design Example 8
      8. 8.2.8  LM2735Y-Q1 SOT-23 Design Example 9
      9. 8.2.9  LM2735X-Q1 WSON Design Example 10
      10. 8.2.10 LM2735Y-Q1 WSON Design Example 11
      11. 8.2.11 LM2735X-Q1 WSON SEPIC Design Example 12
      12. 8.2.12 LM2735X-Q1 SOT-23 LED Design Example 14
      13. 8.2.13 LM2735Y-Q1 WSON FlyBack Design Example 15
      14. 8.2.14 LM2735X-Q1 SOT-23 LED Design Example 16 VRAIL > 5.5 V Application
      15. 8.2.15 LM2735X-Q1 SOT-23 LED Design Example 17 Two-Input Voltage Rail Application
      16. 8.2.16 SEPIC Converter
        1. 8.2.16.1 Detailed Design Procedure
          1. 8.2.16.1.1 SEPIC Design Guide
          2. 8.2.16.1.2 Small Ripple Approximation
          3. 8.2.16.1.3 Steady State Analysis With Loss Elements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 WSON Package
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Definitions
      2. 10.3.2 PCB Design With Thermal Performance in Mind
      3. 10.3.3 LM2735-Q1 Thermal Models
      4. 10.3.4 Calculating Efficiency, and Junction Temperature
        1. 10.3.4.1 Example Efficiency Calculation
      5. 10.3.5 Calculating RθJA and RΨJC
        1. 10.3.5.1 Procedure
        2. 10.3.5.2 Example From Previous Calculations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Custom Design With WEBENCH® Tools
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

When designing for thermal performance, one must consider many variables:

  • Ambient temperature: The surrounding maximum air temperature is fairly explanatory. As the temperature increases, the junction temperature increases. This may not be linear though. As the surrounding air temperature increases, resistances of semiconductors, wires and traces increase. This decreases the efficiency of the application, and more power is converted into heat, increasing the silicon junction temperatures further.
  • Forced airflow: Forced air can drastically reduce the device junction temperature. Air flow reduces the hot spots within a design. Warm airflow is often much better than a lower ambient temperature with no airflow.
  • External components: Choose components that are efficient, and you can reduce the mutual heating between devices.