SNVS485I June   2007  – September 2018 LM2735

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Boost Application Circuit
      2.      Efficiency vs Load Current VO = 12 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM2735
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Soft Start
      4. 7.3.4 Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  LM2735X SOT-23 Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Setting the Output Voltage
        3. 8.2.1.3 Application Curves
      2. 8.2.2  LM2735Y SOT-23 Design Example 2
      3. 8.2.3  LM2735X WSON Design Example 3
      4. 8.2.4  LM2735Y WSON Design Example 4
      5. 8.2.5  LM2735Y MSOP-PowerPAD Design Example 5
      6. 8.2.6  LM2735X SOT-23 Design Example 6
      7. 8.2.7  LM2735Y SOT-23 Design Example 7
      8. 8.2.8  LM2735X SOT-23 Design Example 8
      9. 8.2.9  LM2735Y SOT-23 Design Example 9
      10. 8.2.10 LM2735X WSON Design Example 10
      11. 8.2.11 LM2735Y WSON Design Example 11
      12. 8.2.12 LM2735X WSON SEPIC Design Example 12
      13. 8.2.13 LM2735Y MSOP-PowerPAD SEPIC Design Example 13
      14. 8.2.14 LM2735X SOT-23 LED Design Example 14
      15. 8.2.15 LM2735Y WSON FlyBack Design Example 15
      16. 8.2.16 LM2735X SOT-23 LED Design Example 16 VRAIL > 5.5 V Application
      17. 8.2.17 LM2735X SOT-23 LED Design Example 17 Two-Input Voltage Rail Application
      18. 8.2.18 SEPIC Converter
        1. 8.2.18.1 Detailed Design Procedure
          1. 8.2.18.1.1 SEPIC Design Guide
          2. 8.2.18.1.2 Small Ripple Approximation
          3. 8.2.18.1.3 Steady State Analysis With Loss Elements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 WSON Package
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Definitions
      2. 10.3.2 PCB Design With Thermal Performance in Mind
      3. 10.3.3 LM2735 Thermal Models
      4. 10.3.4 Calculating Efficiency, and Junction Temperature
        1. 10.3.4.1 Example Efficiency Calculation
      5. 10.3.5 Calculating RθJA and RΨJC
        1. 10.3.5.1 Procedure
        2. 10.3.5.2 Example From Previous Calculations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3.5.2 Example From Previous Calculations

PDissipation = 475 mW

TA at Shutdown = 139°C

TCase-Top at Shutdown = 155°C

Equation 61. LM2735 20215857.gif

RθJA WSON = 55°C/W

RψJC WSON = 21°C/W

WSON & MSOP-PowerPAD typical applications will produce RθJA numbers in the range of 50°C/W to 65°C/W, and RψJC will vary from 18°C/W to 28°C/W. These values are for PCB’s with two and four layer boards with 0.5-oz copper, and 4 to 6 thermal vias to bottom side ground plane under the DAP.

For 5-pin SOT-23 package typical applications, RθJA numbers will range from 80°C/W to 110°C/W, and RψJC will vary from 50°C/W to 65°C/W. These values are for PCBs with 2- and 4-layer boards with 0.5-oz copper, with 2 to 4 thermal vias from GND pin to bottom layer.

The following is a good rule of thumb for typical thermal impedances, and an ambient temperature maximum of 75°C: if the design requires more than 400 mW internal to the LM2735 be dissipated, or there is 750 mW of total power loss in the application, TI recommends using the 6-pin WSON or the 8-pin MSOP-PowerPAD package.

NOTE

To use these procedures, it is important to dissipate an amount of power within the device that will indicate a true thermal impedance value. If a very small internal dissipated value is used, it can be determined that the thermal impedance calculated is abnormally high, and subject to error. The graph below shows the nonlinear relationship of internal power dissipation vs RθJA.
LM2735 20215856.gifFigure 50. RθJA vs Internal Dissipation for the WSON
and MSOP-PowerPAD Package