SNVS276I April   2004  – February 2019 LM2743

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Start Up and Soft-Start
      2. 7.3.2  Normal Operation
      3. 7.3.3  Tracking a Voltage Level
      4. 7.3.4  Tracking Voltage Slew Rate
      5. 7.3.5  Sequencing
      6. 7.3.6  SD Pin Impedance
      7. 7.3.7  MOSFET Gate Drivers
      8. 7.3.8  Power Good Signal
      9. 7.3.9  UVLO
      10. 7.3.10 Current Limit
      11. 7.3.11 Foldback Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Synchronous Buck Converter Typical Application using LM2743
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Duty Cycle Calculation
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Inductor
          5. 8.2.1.2.5 Output Capacitor
          6. 8.2.1.2.6 MOSFETs
          7. 8.2.1.2.7 Support Components
          8. 8.2.1.2.8 Control Loop Compensation
          9. 8.2.1.2.9 Efficiency Calculations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Example Circuit 1
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Bill of Materials
      3. 8.2.3 Example Circuit 2
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Bill of Materials
      4. 8.2.4 Example Circuit 3
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Bill of Materials
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM2743 UNIT
TSSOP (PW)
14 PINS
RθJA Junction-to-ambient thermal resistance 107.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.7 °C/W
RθJB Junction-to-board thermal resistance 50.7 °C/W
ψJT Junction-to-top characterization parameter 1.8 °C/W
ψJB Junction-to-board characterization parameter 50 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.