SNVS353F February   2005  – September 2016 LM2753

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Flash LED Selection
      3. 7.3.3 PFM Regulation
      4. 7.3.4 Output Voltage Ripple
      5. 7.3.5 IOUT Pin
        1. 7.3.5.1 Setting Flash Current
        2. 7.3.5.2 Setting Torch Current
      6. 7.3.6 PWM Brightness Control Procedures
      7. 7.3.7 Multi-Level Switch Array
      8. 7.3.8 Thermal Protection
      9. 7.3.9 Power Efficiency
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Mode
      2. 7.4.2 Flash Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitors
        2. 8.2.2.2 Power Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (July 2016) to F Revision

  • Added several Applications Go

Changes from D Revision (May 2013) to E Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed RθJA from "55°C/W" to "52.5°C/W"; add additional thermal values Go

Changes from C Revision (April 2013) to D Revision

  • Changed layout of National Semiconductor data Sheet to TI formatGo