SNVS454E August   2006  – December 2014 LM2830 , LM2830-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM2830
    3. 6.3 ESD Ratings: LM2830-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft-Start
      2. 7.3.2 Output Overvoltage Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Current Limit
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM2830X Design Vo = 1.2 V at 1.0A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
          4. 8.2.1.2.4 Catch Diode
          5. 8.2.1.2.5 Output Voltage
          6. 8.2.1.2.6 Calculating Efficiency, and Junction Temperature
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM2830X Design Vo = 0.6 V at 1.0-A
      3. 8.2.3 LM2830X Design Vo = 3.3 V at 1.0-A
      4. 8.2.4 LM2830Z Design Vo = 3.3 V at 1.0-A
      5. 8.2.5 LM2830Z Design Vo = 1.2 V at 1.0-A
      6. 8.2.6 LM2830X Dual Converters With Delayed Enabled Design
      7. 8.2.7 LM2830X Buck Converter and Voltage Double Circuit With LDO Follower
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 WSON Package
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Thermal Definitions
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

WSON Package
6-Pin
Top View
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SOT Package
5-Pins
Top View
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Pin Functions (5-Pin SOT)

PIN I/O(1) DESCRIPTION
NAME NO.
SW 1 O Output switch. Connect to the inductor and catch diode.
GND 2 G Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin.
FB 3 I Feedback pin. Connect to external resistor divider to set output voltage.
EN 4 I Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN + 0.3 V.
VIN 5 I/P Input supply voltage.
(1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin

Pin Functions (6-Pin WSON)

PIN I/O(1) DESCRIPTION
NAME NO.
FB 1 I Feedback pin. Connect to external resistor divider to set output voltage.
GND 2 G Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin.
SW 3 O Output switch. Connect to the inductor and catch diode.
VIND 4 I/P Power Input supply.
VINA 5 I/P Control circuitry supply voltage. Connect VINA to VIND on PC board.
EN 6 I Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VINA + 0.3V.
Die Attach Pad – – Connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection.
(1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin