SNVS454E August   2006  – December 2014 LM2830 , LM2830-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM2830
    3. 6.3 ESD Ratings: LM2830-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft-Start
      2. 7.3.2 Output Overvoltage Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Current Limit
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM2830X Design Vo = 1.2 V at 1.0A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
          4. 8.2.1.2.4 Catch Diode
          5. 8.2.1.2.5 Output Voltage
          6. 8.2.1.2.6 Calculating Efficiency, and Junction Temperature
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM2830X Design Vo = 0.6 V at 1.0-A
      3. 8.2.3 LM2830X Design Vo = 3.3 V at 1.0-A
      4. 8.2.4 LM2830Z Design Vo = 3.3 V at 1.0-A
      5. 8.2.5 LM2830Z Design Vo = 1.2 V at 1.0-A
      6. 8.2.6 LM2830X Dual Converters With Delayed Enabled Design
      7. 8.2.7 LM2830X Buck Converter and Voltage Double Circuit With LDO Follower
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 WSON Package
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Thermal Definitions
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT
VIN –0.5 7 V
FB Voltage –0.5 3 V
EN Voltage –0.5 7 V
SW Voltage –0.5 7 V
Junction Temperature(1) 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings: LM2830

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM2830-Q1

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
Charged device model (CDM), per AEC Q100-011 WSON corner pins (1, 3, 4, and 6) ±1000
SOT-23 corner pins (1, 3, 4, and 5) ±1000
Other pins ±1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN 3 5.5 V
Junction Temperature –40 125 °C

6.5 Thermal Information

THERMAL METRIC(1) LM2830, LM2830-Q1 LM2830 UNIT
DBV NGG
5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 165.2 53.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 69.9 51.2
RθJB Junction-to-board thermal resistance 27.3 28.2
ψJT Junction-to-top characterization parameter 1.8 0.6
ψJB Junction-to-board characterization parameter 26.8 28.3
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 8.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.6 Electrical Characteristics

VIN = 5 V unless otherwise indicated. Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over –40°C to 125°C junction temperature range unless otherwise stated.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback Voltage WSON and SOT-23 Package 0.588 0.600 0.612 V
ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3 V to 5 V 0.02 %/V
IB Feedback Input Bias Current 0.1 100 nA
UVLO Undervoltage Lockout VIN Rising 2.73 2.90 V
VIN Falling 1.85 2.3
UVLO Hysteresis 0.43
FSW Switching Frequency LM2830-X 1.2 1.6 1.95 MHz
LM2830-Z 2.25 3.0 3.75
DMAX Maximum Duty Cycle LM2830-X 86% 94%
LM2830-Z 82% 90%
DMIN Minimum Duty Cycle LM2830-X 5%
LM2830-Z 7%
RDS(ON) Switch On Resistance WSON Package 150 mΩ
SOT-23 Package 130 195
ICL Switch Current Limit VIN = 3.3 V 1.2 1.75 A
VEN_TH Shutdown Threshold Voltage 0.4 V
Enable Threshold Voltage 1.8
ISW Switch Leakage 100 nA
IEN Enable Pin Current Sink/Source 100 nA
IQ Quiescent Current (switching) LM2830X VFB = 0.55 3.3 5 mA
LM2830Z VFB = 0.55 4.3 6.5 mA
Quiescent Current (shutdown) All Options VEN = 0 V 30 nA
TSD Thermal Shutdown Temperature 165 °C
(1) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.7 Typical Characteristics

All curves taken at VIN = 5.0 V with configuration in typical application circuit shown in Application Information section of this data sheet. TJ = 25°C, unless otherwise specified.
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Figure 1. η vs Load "X" Vin = 5 V, Vo = 1.8 V and 3.3 V
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Figure 3. η vs Load "X and Z" Vin = 3.3 V, Vo = 1.8 V
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Figure 5. Load Regulation Vin = 5 V, Vo = 1.8 V (All Options)
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Figure 7. Oscillator Frequency vs Temperature - "X"
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Figure 9. Current Limit vs Temperature Vin = 3.3 V
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Figure 11. RDSON vs Temperature (SOT-23 Package)
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Figure 13. LM2830Z IQ (Quiescent Current)
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Figure 15. VFB vs Temperature
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Figure 17. Phase Plot vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A)
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Figure 2. η vs Load "Z" Vin = 5 V, Vo = 3.3 V and 1.8 V
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Figure 4. Load Regulation Vin = 3.3 V, Vo = 1.8 V (All Options)
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Figure 6. Load Regulation Vin = 5 V, Vo = 3.3 V (All Options)
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Figure 8. Oscillator Frequency vs Temperature - "Z"
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Figure 10. RDSON vs Temperature (WSON Package)
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Figure 12. LM2830X IQ (Quiescent Current)
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Figure 14. Line Regulation Vo = 1.8 V, Io = 500 mA
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Figure 16. Gain vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A)