SLCS142G December   2003  – March 2023 LM2901-Q1 , LM2901AV-Q1 , LM2901B-Q1 , LM2901V-Q1

PRODMIX  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings for  LM2901B-Q1
    2. 6.2  Absolute Maximum Ratings for LM2901x-Q1
    3. 6.3  ESD Ratings for LM2901B-Q1
    4. 6.4  ESD Ratings for LM2901x-Q1
    5. 6.5  Recommended Operating Conditions for LM2901B-Q1
    6. 6.6  Recommended Operating Conditions for LM2901x-Q1
    7. 6.7  Thermal Information for LM2901B-Q1
    8. 6.8  Thermal Information for LM2901x-Q1
    9. 6.9  Electrical Characteristics for LM2901B-Q1
    10. 6.10 Switching Characteristics for LM2901B-Q1
    11. 6.11 Electrical Characteristics for LM2901x-Q1
    12. 6.12 Switching Characteristics for LM2901x-Q1
    13. 6.13 Typical Characteristics: LM2901B-Q1
    14. 6.14 Typical Characteristics: LM2901x-Q1
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 Minimum Overdrive Voltage
        3. 8.2.2.3 Output and Drive Current
        4. 8.2.2.4 Response Time
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

Figure 5-1 D, PW and DYY Packages
14-Pin SOIC, TSSOP and SOT-23
Top View
Figure 5-3 RUC Package
14-Pad X2QFN
Top View
GUID-3C5E592E-798E-48F5-B9C7-1B6C357C332B-low.gif
NOTE: Connect exposed thermal pad directly to GND pin.
Figure 5-2 RTE Package
16-Pad WQFN With Exposed Thermal Pad
Top View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME(1) SOIC,

TSSOP, DYY

X2QFN WQFN
OUT1 (1) 1 14 16 Output Output pin of the comparator 2
OUT2 (1) 2 1 15 Output Output pin of the comparator 1
VCC 3 2 1 Positive supply
IN2– (1) 4 3 5 Input Negative input pin of the comparator 1
IN2+ (1) 5 4 6 Input Positive input pin of the comparator 1
IN1– (1) 6 5 2 Input Negative input pin of the comparator 2
IN1+ (1) 7 6 4 Input Positive input pin of the comparator 2
IN3– 8 7 7 Input Negative input pin of the comparator 3
IN3+ 9 8 8 Input Positive input pin of the comparator 3
IN4– 10 9 9 Input Negative input pin of the comparator 4
IN4+ 11 10 11 Input Positive input pin of the comparator 4
GND 12 11 12 Negative supply
OUT4 13 12 13 Output Output pin of the comparator 4
OUT3 14 13 14 Output Output pin of the comparator 3
NC 3 No Internal Connection - Leave floating or GND
NC 10 No Internal Connection - Leave floating or GND
Thermal Pad PAD Connect directly to GND pin
Some manufacturers transpose the names of channels 1 & 2. Electrically the pinouts are identical, just a difference in channel naming convention.