SLCS142G December 2003 – March 2023 LM2901-Q1 , LM2901AV-Q1 , LM2901B-Q1 , LM2901V-Q1
PRODMIX
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | LM2901B-Q1 | UNIT | |||||
---|---|---|---|---|---|---|---|
D (SOIC) |
PW (TSSOP) |
DDY (SOT-23) |
RTE (QFN) |
RUC (X2QFN) |
|||
14 PINS | 14 PINS | 14 PINS | 16 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 111.2 | 136.6 | °C/W | |||
RθJC(top) | Junction-to-case (top) thermal resistance | 66.9 | 66.6 | ||||
RθJB | Junction-to-board thermal resistance | 67.8 | 79.8 | ||||
ψJT | Junction-to-top characterization parameter | 28.0 | 17.8 | ||||
ψJB | Junction-to-board characterization parameter | 67.4 | 79.3 | ||||
RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | - |