SGLS178H August 2003 – October 2023 LM2902-Q1 , LM2902B-Q1 , LM2902BA-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | LM2902-Q1, LM2902KV-Q1, LM2902KAV-Q1 | LM2902B-Q1, LM2902BA-Q1 | UNIT | |||
---|---|---|---|---|---|---|
D (SOIC) | PW (TSSOP) | D (SOIC) | PW (TSSOP) | |||
14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 101 | 86 | TBD | 133.3 | °C/W |
RθJC | Junction-to-case (top) thermal resistance | — | — | TBD | 63.4 | °C/W |
RθJB | Junction-to-board thermal resistance | — | — | TBD | 76.5 | °C/W |
ψJT | Junction-to-top characterization parameter | — | — | TBD | 15.6 | °C/W |
ψJB | Junction-to-board characterization parameter | — | — | TBD | 75.9 | °C/W |